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MC74LVX259DTR2

Onsemi

MC74LVX259DTR2 by Onsemi

MC74LVX259DTR2 by Onsemi is an 8-bit decoder with 14ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 3.3V and has a max I (ol) of 4A. With surface mount capability and a small outline package style, it offers efficient performance in compact designs.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

390

-

$0.119

$0.099

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,181 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

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1,181

$0.093

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$8.203

100+ parts

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600

$8.203

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Vyrian

USA . 6,182 parts In-Stock

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6,182

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Distributors (Availability)

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Ampacity Inc.

Singapore . 178 parts In-Stock

1+ parts

$0.083

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178

$0.083

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Corphita

USA . 1,516 parts In-Stock

1+ parts

$0.088

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-

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1,516

$0.088

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-

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Corohmni

South Africa . 214 parts In-Stock

1+ parts

$0.098

100+ parts

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214

$0.098

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AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$20.430

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758

$20.430

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Kulean Microsystems

USA . 6,995 parts In-Stock

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6,995

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SupplyDigital Components

Austria . 4,022 parts In-Stock

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TANS Electronics

Latvia . 623 parts In-Stock

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623

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Problanco Electronics

Mexico . 378 parts In-Stock

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378

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Microchip USA

USA . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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192

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Overview

Enhance your electronic projects with the MC74LVX259DTR2 decoder and driver by Onsemi. Designed with top-notch quality and reliability, this product offers seamless integration and optimal performance. Ideal for a wide range of applications, this decoder & driver provides efficient input conditioning and fast propagation delay, ensuring smooth operation. With its compact design and advanced technology, the MC74LVX259DTR2 delivers high value and benefits to customers looking for precision and durability in their designs. Elevate your projects with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat and chemicals, making this decoder and driver a reliable choice for various applications.

Propagation Delay At Nominal Supply: 14 ns

The low propagation delay ensures fast signal processing and response times, making this decoder and driver suitable for high-speed applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and efficient assembly onto printed circuit boards, saving time and cost during manufacturing.

No. of Bits: 8

With 8 bits, this decoder and driver can process a wide range of input signals and provide corresponding output, making it versatile for various digital applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low nominal supply voltage of 2.7V, this decoder and driver offers energy efficiency and can be powered by common power sources.

Output Characteristics: 3-STATE

Having 3-state output characteristics allows this decoder and driver to provide additional flexibility in controlling output signals, enabling more complex circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature ranges, this decoder and driver can withstand harsh environments and maintain reliable performance in extreme conditions.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making this decoder and driver suitable for battery-powered devices and applications requiring stable operation.

Technical Specifications

Decoder & Drivers MC74LVX259DTR2 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74LVX259DTR2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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