Loading...

MC74LVX245MELG

Onsemi

MC74LVX245MELG by Onsemi

MC74LVX245MELG by Onsemi is an 8-bit bus driver with 11.5ns propagation delay, operating at a supply voltage of 2.7-3.3V. It features a small outline package and is ideal for bidirectional control applications in industrial settings due to its CMOS technology and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,526

-

-

-

-

Digiode

USA . 2,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,236

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$19.290

100+ parts

-

1k+ parts

-

10k+ parts

-

380

$19.290

-

-

-

Problanco Electronics

Mexico . 8,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,320

-

-

-

-

Kulean Microsystems

USA . 7,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,629

-

-

-

-

TANS Electronics

Latvia . 6,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,977

-

-

-

-

SupplyDigital Components

Austria . 3,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,643

-

-

-

-

Corphita

USA . 1,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,967

-

-

-

-

UHIMA Technologies

Türkiye . 778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

778

-

-

-

-

Corohmni

South Africa . 403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

403

-

-

-

-

Microchip USA

USA . 136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

136

-

-

-

-

Overview

Experience seamless data transmission and reliable performance with the MC74LVX245MELG by Onsemi. As a leading manufacturer in the industry, Onsemi's bus driver & transceivers are designed for high-quality applications, ensuring superior functionality and durability. Whether you're looking to enhance communication systems or streamline data transfer processes, this product offers unmatched value, benefits, and advantages to meet your needs. Upgrade your projects with Onsemi's innovative technology and trust in the exceptional quality that sets them apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay allows for efficient data transmission and quick response time.

Surface Mount: YES

Easy installation on PCBs, saving space and improving overall product design.

Nominal Supply Voltage / Vsup (V): 2.7

Efficient power usage at a moderate voltage level, suitable for a variety of applications.

Output Characteristics: 3-STATE

Allows for high impedance output state, enabling flexibility in connecting multiple devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in challenging conditions.

Technical Specifications

Bus Driver & Transceivers MC74LVX245MELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

5.275 mm

Trade Compliance

MC74LVX245MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20