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MC74LCX16373DTG

Onsemi

MC74LCX16373DTG by Onsemi

MC74LCX16373DTG by Onsemi is a bus driver & transceiver with 8 bits and 2 functions. It has a propagation delay of 5.4 ns and operates at a nominal voltage of 2.5V. This component is commonly used in industrial applications due to its small size, low power consumption, and high-speed performance.

Median Price

$1.584

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,287 parts In-Stock

1+ parts

$1.060

100+ parts

$0.995

1k+ parts

$0.900

10k+ parts

-

1,287

$1.060

$0.995

$0.900

-

Farnell

UK . 28 parts In-Stock

1+ parts

$1.680

100+ parts

$1.040

1k+ parts

$0.909

10k+ parts

$0.822

28

$1.680

$1.040

$0.909

$0.822

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

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-

1

$2.120

-

-

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Element14

Singapore . 553 parts In-Stock

1+ parts

$3.450

100+ parts

$1.890

1k+ parts

$1.370

10k+ parts

$1.350

553

$3.450

$1.890

$1.370

$1.350

Verical

USA . 624 parts In-Stock

1+ parts

-

100+ parts

$1.487

1k+ parts

$1.015

10k+ parts

$0.552

624

-

$1.487

$1.015

$0.552

Arrow

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$0.855

1k+ parts

$0.778

10k+ parts

$0.717

7

-

$0.855

$0.778

$0.717

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 189 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

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189

$0.263

-

-

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Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$0.895

100+ parts

-

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-

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18

$0.895

-

-

-

Mobius Materials

USA . 338 parts In-Stock

1+ parts

$1.401

100+ parts

$1.115

1k+ parts

-

10k+ parts

-

338

$1.401

$1.115

-

-

Flip Electronics

USA . 7,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,800

-

-

-

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Vyrian

USA . 2,373 parts In-Stock

1+ parts

-

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2,373

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Bristol Electronics

USA . 1,212 parts In-Stock

1+ parts

-

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1,212

-

-

-

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Atlantic Semiconductor

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

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-

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1,212

-

-

-

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NAC Semi

USA . 1,209 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

-

10k+ parts

$2.720

1,209

-

$2.940

-

$2.720

ComSIT Distribution GmbH

Germany . 27 parts In-Stock

1+ parts

-

100+ parts

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27

-

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Prism Electronics

USA . 21 parts In-Stock

1+ parts

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21

-

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Ashlea Components Ltd

UK . 20 parts In-Stock

1+ parts

-

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20

-

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EMSNET

USA . 12 parts In-Stock

1+ parts

-

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12

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 320 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

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320

$0.235

-

-

-

Corphita

USA . 1,132 parts In-Stock

1+ parts

$0.249

100+ parts

-

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-

10k+ parts

-

1,132

$0.249

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$0.895

100+ parts

-

1k+ parts

-

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50

$0.895

-

-

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Corohmni

South Africa . 162 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

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162

$1.060

-

-

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Continental Prestige Electronics

USA . 1,480 parts In-Stock

1+ parts

$1.330

100+ parts

$1.040

1k+ parts

$0.701

10k+ parts

-

1,480

$1.330

$1.040

$0.701

-

Lixinc

USA . 17,877 parts In-Stock

1+ parts

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17,877

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Perfect Parts

USA . 9,541 parts In-Stock

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9,541

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A-Z Elektronik GmbH

Germany . 6,143 parts In-Stock

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6,143

-

-

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Kulean Microsystems

USA . 5,778 parts In-Stock

1+ parts

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5,778

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-

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SupplyDigital Components

Austria . 4,481 parts In-Stock

1+ parts

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4,481

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Kepictronics

USA . 2,200 parts In-Stock

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2,200

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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-

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Speed Components Ltd (Excess)

Israel . 1,911 parts In-Stock

1+ parts

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100+ parts

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1,911

-

-

-

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TANS Electronics

Latvia . 1,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,618

-

-

-

-

Eastek

USA . 1,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,599

-

-

-

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Problanco Electronics

Mexico . 263 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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263

-

-

-

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UHIMA Technologies

Türkiye . 199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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199

-

-

-

-

Overview

Discover the MC74LCX16373DTG by Onsemi, a high-quality bus driver and transceiver that offers incredible value and benefits to customers. Manufactured by Onsemi, a trusted industry leader, this product is designed to deliver superior performance and reliability. With its compact size and surface mount technology, it is perfect for a wide range of applications. Experience fast propagation delay and true output polarity, ensuring efficient data transmission. Don't miss out on this versatile and reliable solution for all your bus driving and transceiver needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 5.4 ns

With a low propagation delay, this product ensures fast and efficient data transmission, making it suitable for high-speed bus driver applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions within a single component increases functionality and versatility, making it a cost-effective choice for bus driver and transceiver requirements.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and compatible with standard PCB layouts, facilitating integration into existing designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low supply voltage of 2.5V helps in reducing power consumption and heat generation, making it energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50pF ensures stable and reliable signal transmission, especially in high capacitance environments, making it a reliable choice for bus driver applications.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V offers compatibility with a wide range of systems and devices, making it a versatile option for various applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the product's functionality and versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, allowing for compact designs and efficient use of board real estate.

Maximum I (ol): 24 Amp

With a maximum output current of 24A, this product can drive high loads and provide robust performance in demanding applications.

Propagation Delay (tpd): 6.6 ns

Although slightly higher than the nominal supply propagation delay, the 6.6ns propagation delay still ensures fast data transmission, meeting the requirements of bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C allows for reliable operation in various environmental conditions, ensuring the product's performance and longevity.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, enabling tristate logic operations and bidirectional communication, enhancing the product's versatility.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C allows for reliable operation in cold environments, making the product suitable for a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and reliability, ensuring robust electrical connections and long-term performance.

Terminal Position: DUAL

Having dual terminal positions enhances the product's versatility and ease of installation, providing flexibility in PCB layout and component orientation.

No. of Ports: 2

Featuring two ports allows for multiple connections and versatile data routing capabilities, making it a suitable choice for bus driver and transceiver applications requiring dual communication channels.

Maximum Seated Height: 1.1 mm

The maximum seated height of 1.1mm ensures a low profile design, making it suitable for compact electronic devices and applications with space constraints.

Width: 6.1 mm

The narrow width of 6.1mm saves space on the PCB, enabling compact designs and efficient use of board real estate in tight layouts.

Output Polarity: TRUE

Having true output polarity ensures correct signal transmission and reception, eliminating the need for additional signal inversion circuits, simplifying system design and integration.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, the product can operate efficiently even under low voltage conditions, making it suitable for battery-powered applications and energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures reliable and consistent soldering during assembly, maintaining the product's electrical and mechanical integrity.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature soldering processes, ensuring proper solder joint formation and reliable connections.

Length: 12.5 mm

The compact length of 12.5mm saves space on the PCB, contributing to a smaller footprint and efficient layout designs in space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial and automotive applications that require robust performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, fast switching speeds, and high noise immunity, making the product energy-efficient and reliable in various digital applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical mounting, easy soldering, and excellent thermal conduction, ensuring reliable electrical connections and mechanical stability.

Packing Method: RAIL

The rail packing method facilitates efficient handling, storage, and assembly of the product, ensuring convenient integration into manufacturing processes and production lines.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the product offers fine pin spacing for high-density PCB layouts, enabling compact designs and precise signal routing in space-constrained applications.

Maximum Supply Voltage (Vsup): 3.6 V

Operating within a maximum supply voltage of 3.6V ensures compatibility with standard power sources and protects the product from potential voltage spikes, enhancing its reliability and longevity.

Technical Specifications

Bus Driver & Transceivers MC74LCX16373DTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

MC74LCX16373DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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