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MC74HCT365ADTG

Onsemi

MC74HCT365ADTG by Onsemi

MC74HCT365ADTG by Onsemi is a 6-bit bus driver with 36ns propagation delay at 5V. It features 3-STATE output, operates in -55 to 125 °C, and has a package size of 5x4.4mm. Ideal for military-grade applications requiring fast signal transmission and low power consumption.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 96 parts In-Stock

1+ parts

$0.490

100+ parts

$0.292

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96

$0.490

$0.292

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Rochester

USA . 41,996 parts In-Stock

1+ parts

-

100+ parts

$0.197

1k+ parts

$0.164

10k+ parts

$0.146

41,996

-

$0.197

$0.164

$0.146

Farnell

UK . 41,996 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.110

41,996

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$0.110

Verical

USA . 32,736 parts In-Stock

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-

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$0.183

32,736

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$0.183

Distributors (In-Stock)

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Digiode

USA . 142 parts In-Stock

1+ parts

$0.154

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142

$0.154

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Vyrian

USA . 8,271 parts In-Stock

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8,271

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Distributors (Availability)

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Corohmni

South Africa . 431 parts In-Stock

1+ parts

$0.110

100+ parts

-

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431

$0.110

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-

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Corphita

USA . 1,579 parts In-Stock

1+ parts

$0.146

100+ parts

-

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10k+ parts

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1,579

$0.146

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Component Stockers USA

USA . 7,855 parts In-Stock

1+ parts

$0.160

100+ parts

$0.150

1k+ parts

$0.140

10k+ parts

-

7,855

$0.160

$0.150

$0.140

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Continental Prestige Electronics

USA . 11,488 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.110

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11,488

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$0.110

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Perfect Parts

USA . 8,387 parts In-Stock

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8,387

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SupplyDigital Components

Austria . 7,171 parts In-Stock

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Problanco Electronics

Mexico . 4,354 parts In-Stock

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4,354

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Kulean Microsystems

USA . 1,275 parts In-Stock

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1,275

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TANS Electronics

Latvia . 847 parts In-Stock

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847

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UHIMA Technologies

Türkiye . 140 parts In-Stock

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140

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Overview

Enhance the efficiency of your electronic circuits with the MC74HCT365ADTG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MC74HCT365ADTG falls under the Bus Driver & Transceivers category, making it perfect for various applications. With a fast propagation delay, low power consumption, and 3-STATE output characteristics, this product offers exceptional value to customers. Upgrade your projects with the MC74HCT365ADTG and experience enhanced performance and durability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable and rugged applications.

Propagation Delay at Nominal Supply: 36 ns

With a low propagation delay, the product ensures fast and efficient signal transmission, making it suitable for high-speed data communication.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, the product is compatible with a wide range of systems and power sources.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption and high noise immunity, making it efficient and reliable in various applications.

Technical Specifications

Bus Driver & Transceivers MC74HCT365ADTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC74HCT365ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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