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MC74HCT244ANG

Onsemi

MC74HCT244ANG by Onsemi

MC74HCT244ANG by Onsemi is a 20-terminal bus driver with 30ns propagation delay at 5V. It features 2 functions, 4 bits, and can handle up to 6A output current. Ideal for applications requiring true output polarity and military-grade temperature tolerance.

Median Price

$0.557

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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$0.557

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Semi Source

USA . 5,598 parts In-Stock

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Vyrian

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Digiode

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PC Components Company LLC

USA . 188 parts In-Stock

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Bristol Electronics

USA . 188 parts In-Stock

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Inventory MP

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Mil-Aero Solutions, Inc.

USA . 36 parts In-Stock

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J2 Sourcing AB

Sweden . 31 parts In-Stock

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Connector Distribution Corp

USA . 7 parts In-Stock

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Right Parts Inc.

USA . 7 parts In-Stock

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Technoshack Inc.

Canada . 6 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,814 parts In-Stock

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$0.557

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$0.546

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Argo Parts USA

USA . 3,798 parts In-Stock

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$0.557

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$0.540

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Bastille Electronics

Australia . 324 parts In-Stock

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$0.557

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$0.529

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$0.503

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$0.496

324

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$0.529

$0.503

$0.496

AZTECH Wire

Italy . 210 parts In-Stock

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$6.410

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Aztec Data Supply Inc.

USA . 2,408 parts In-Stock

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Semicontronic

India . 148 parts In-Stock

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$31.000

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$30.225

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$30.070

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Ampacity Inc.

Singapore . 578 parts In-Stock

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$41.000

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SupplyDigital Components

Austria . 8,006 parts In-Stock

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Problanco Electronics

Mexico . 6,768 parts In-Stock

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TANS Electronics

Latvia . 6,234 parts In-Stock

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Kulean Microsystems

USA . 5,226 parts In-Stock

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Corphita

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Microchip USA

USA . 212 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the reliable MC74HCT244ANG by Onsemi, a top-tier manufacturer known for their high-quality components. This bus driver and transceiver device offers seamless communication between multiple components, making it perfect for applications in various industries. With fast propagation delay, low power consumption, and 3-state output characteristics, this product provides exceptional value and performance. Trust Onsemi for cutting-edge technology that delivers unmatched benefits to customers seeking efficiency and reliability in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast and efficient data transmission within the bus driver and transceivers.

No. of Functions: 2

Having multiple functions in a single device helps in saving space and reducing the overall complexity of the system.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, ensuring compatibility with a wide range of systems.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing errors in data communication.

Technical Specifications

Bus Driver & Transceivers MC74HCT244ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HCT244ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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