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MC74HC540AFELG

Onsemi

MC74HC540AFELG by Onsemi

MC74HC540AFELG by Onsemi is an 8-bit bus driver with 28ns propagation delay, operating at 3V. It features a small outline package, 6A output current, and -55 to 125 °C temperature range. Ideal for applications requiring inverted output polarity and enable low control type in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,685 parts In-Stock

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Digiode

USA . 1,969 parts In-Stock

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AZTECH Wire

Italy . 698 parts In-Stock

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Kulean Microsystems

USA . 8,287 parts In-Stock

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TANS Electronics

Latvia . 6,811 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,777 parts In-Stock

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SupplyDigital Components

Austria . 4,922 parts In-Stock

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Corphita

USA . 2,066 parts In-Stock

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Problanco Electronics

Mexico . 1,824 parts In-Stock

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Corohmni

South Africa . 306 parts In-Stock

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Microchip USA

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UHIMA Technologies

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Overview

Enhance your electronic designs with the MC74HC540AFELG by Onsemi, a top-of-the-line bus driver & transceiver that offers superior quality and reliability. With a compact package body material made of PLASTIC/EPOXY, this product boasts a fast propagation delay at a nominal supply of 28 ns, making it ideal for applications requiring quick signal transmission. The 8-bit configuration and 3-STATE output characteristics provide versatility for various projects. Trust in Onsemi's reputation for excellence and choose the MC74HC540AFELG for seamless integration and exceptional performance in your next design project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 28 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time during assembly.

Nominal Supply Voltage / Vsup (V): 3

With a low nominal supply voltage, this product offers energy efficiency and can operate in systems with lower power requirements.

Output Characteristics: 3-STATE

The 3-state output allows for multiple drivers to be connected to a common bus line without causing conflicts, enhancing the flexibility of the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver and transceiver efficient and reliable in various applications.

Technical Specifications

Bus Driver & Transceivers MC74HC540AFELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC540AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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