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MC74HC245AFG

Onsemi

MC74HC245AFG by Onsemi

MC74HC245AFG by Onsemi is an 8-bit bus driver with 22ns propagation delay. It operates at a nominal voltage of 3V, suitable for bidirectional applications in military-grade environments. This CMOS technology device features a small outline package and supports common control with 3-state output characteristics.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

3,225

-

$0.502

$0.417

$0.371

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

3,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 989 parts In-Stock

1+ parts

$0.391

100+ parts

-

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-

10k+ parts

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989

$0.391

-

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Vyrian

USA . 4,431 parts In-Stock

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4,431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,402 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

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1,402

$0.371

-

-

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.412

100+ parts

-

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109

$0.412

-

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-

AZTECH Wire

Italy . 104 parts In-Stock

1+ parts

$19.630

100+ parts

-

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104

$19.630

-

-

-

Problanco Electronics

Mexico . 7,678 parts In-Stock

1+ parts

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7,678

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Kulean Microsystems

USA . 7,318 parts In-Stock

1+ parts

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7,318

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SupplyDigital Components

Austria . 3,836 parts In-Stock

1+ parts

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3,836

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Continental Prestige Electronics

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

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10k+ parts

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3,225

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$0.357

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TANS Electronics

Latvia . 1,658 parts In-Stock

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1,658

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Perfect Parts

USA . 974 parts In-Stock

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974

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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582

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Microchip USA

USA . 190 parts In-Stock

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190

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Overview

Unlock the power of seamless data transmission with the MC74HC245AFG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers and transceivers that offer unparalleled reliability and efficiency. This versatile product is ideal for a wide range of applications, providing customers with a cost-effective solution for their electronic needs. With a compact design and advanced features, the MC74HC245AFG ensures fast propagation delay and optimal performance. Trust Onsemi to deliver cutting-edge technology that meets your demands and exceeds your expectations. Elevate your projects with the MC74HC245AFG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to wear and tear.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay, this product ensures efficient and fast signal transmission, reducing latency in communication systems.

Surface Mount: YES

Being surface mountable makes installation and assembly convenient, saving time and effort in the manufacturing process.

No. of Bits: 8

Having 8 bits allows for a wide range of data processing capabilities, making this product suitable for applications that require handling multiple bits of information.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product energy-efficient, reducing power consumption and operating costs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Technical Specifications

Bus Driver & Transceivers MC74HC245AFG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

5.275 mm

Trade Compliance

MC74HC245AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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