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MC74HC139ADTR2

Onsemi

MC74HC139ADTR2 by Onsemi

MC74HC139ADTR2 by Onsemi is a CMOS Decoder & Drivers with 35ns Propagation Delay, 4A Max I (ol), and -55 to 125 °C Operating Temp. Ideal for military applications, it has 16 terminals in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 2,460 parts In-Stock

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Digiode

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Connector Distribution Corp

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Right Parts Inc.

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AZTECH Wire

Italy . 557 parts In-Stock

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Problanco Electronics

Mexico . 8,252 parts In-Stock

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Kulean Microsystems

USA . 4,729 parts In-Stock

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SupplyDigital Components

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TANS Electronics

Latvia . 2,009 parts In-Stock

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UHIMA Technologies

Türkiye . 857 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the power of efficient signal decoding and driving with the Onsemi MC74HC139ADTR2. With a focus on quality and reliability, Onsemi ensures that this decoder and driver delivers top-notch performance in various applications. From consumer electronics to industrial automation, this product offers exceptional value to customers by providing fast propagation delay, inverted output polarity, and a wide temperature range for reliable operation. Trust Onsemi to provide cutting-edge technology and superior products for all your decoding and driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection to the internal components of the decoder & driver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 35 ns

With a low propagation delay at nominal supply, this decoder & driver ensures fast and efficient signal processing, making it suitable for applications where timing is critical.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards, making it convenient for integration into various electronic devices.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making the decoder & driver versatile and suitable for various applications.

No. of Functions: 2

With multiple functions in a single device, this decoder & driver offers cost-effectiveness and space efficiency in electronic systems.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the decoder & driver, ensuring reliable performance within the specified voltage range.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in stabilizing the output signal and reducing noise, resulting in improved signal quality and overall performance of the decoder & driver.

Power Supplies (V): 2/6

Compatibility with power supplies ranging from 2V to 6V gives flexibility in power source options for the decoder & driver, making it suitable for a variety of applications.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this decoder & driver can drive high-power loads effectively, making it suitable for demanding applications.

Propagation Delay (tpd): 175 ns

Although not the fastest, the propagation delay of 175 ns still ensures efficient signal processing and reliable operation of the decoder & driver in various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the decoder & driver to withstand elevated temperatures, making it suitable for use in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the decoder & driver can function reliably even in extreme cold temperatures, enhancing its versatility in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable connections for the decoder & driver.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and connection options, making installation and integration of the decoder & driver convenient in different designs.

Maximum Seated Height: 1.2 mm

The compact maximum seated height of 1.2 mm allows for low-profile installation of the decoder & driver, making it suitable for space-constrained applications.

Width: 4.4 mm

The slim width of 4.4 mm enables easy integration of the decoder & driver in compact electronic devices, contributing to space-saving and efficient design.

Output Polarity: INVERTED

The inverted output polarity provides flexibility in signal processing and compatibility with various other components in the circuit, making the decoder & driver versatile in different applications.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage of 2V, this decoder & driver can operate effectively even in low-power scenarios, expanding its usability in energy-efficient applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures the decoder & driver can withstand the soldering process during assembly, maintaining its integrity and functionality.

Length: 5 mm

The compact length of 5 mm contributes to the overall small form factor of the decoder & driver, making it suitable for applications where space is a premium.

Temperature Grade: MILITARY

Having a military-grade temperature rating ensures the decoder & driver can withstand extreme temperature variations and harsh operating conditions, making it reliable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & driver efficient and reliable in various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical connections and easy soldering during installation, ensuring reliable performance of the decoder & driver in demanding applications.

Packing Method: TR

The TR packing method offers protection and easy handling during transportation and storage, preserving the quality and integrity of the decoder & driver until it is ready for use.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density mounting of the decoder & driver on circuit boards, enabling compact and efficient electronic designs.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this decoder & driver can handle higher voltage levels, providing flexibility in power source options for a wide range of applications.

Technical Specifications

Decoder & Drivers MC74HC139ADTR2 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74HC139ADTR2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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