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MC74ACT541NG

Onsemi

MC74ACT541NG by Onsemi

MC74ACT541NG by Onsemi is an 8-bit bus driver with 8.5ns propagation delay at 5V, suitable for industrial applications. It features a max I (ol) of 24A, TRUE output polarity, and operates b/w -40 to 85 °C. With a package style of IN-LINE and through-hole terminal form, it is ideal for enabling low control in various electronic systems.

Median Price

$0.592

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

$0.592

100+ parts

$0.556

1k+ parts

$0.503

10k+ parts

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15

$0.592

$0.556

$0.503

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Distributors (In-Stock)

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Digiode

USA . 1,701 parts In-Stock

1+ parts

$0.535

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1,701

$0.535

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Vyrian

USA . 5,345 parts In-Stock

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5,345

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A&K Electronics

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Corphita

USA . 1,282 parts In-Stock

1+ parts

$0.507

100+ parts

-

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1,282

$0.507

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Corohmni

South Africa . 458 parts In-Stock

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$0.563

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458

$0.563

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Component Stockers USA

USA . 20 parts In-Stock

1+ parts

$0.580

100+ parts

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20

$0.580

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$14.500

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570

$14.500

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Problanco Electronics

Mexico . 6,213 parts In-Stock

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6,213

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Kulean Microsystems

USA . 6,033 parts In-Stock

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SupplyDigital Components

Austria . 5,902 parts In-Stock

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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498

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TANS Electronics

Latvia . 479 parts In-Stock

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479

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Microchip USA

USA . 145 parts In-Stock

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145

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Perfect Parts

USA . 1 parts In-Stock

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Overview

Enhance the efficiency and reliability of your electronic systems with the MC74ACT541NG Bus Driver & Transceiver by Onsemi. With a commitment to quality and innovation, Onsemi delivers top-notch products that guarantee superior performance. This versatile component, featuring 8 bits and a 3-STATE output, is ideal for a wide range of applications. From automotive to industrial settings, this product offers unmatched precision and speed, ensuring seamless operation and optimal functionality. Trust Onsemi to provide the best solutions for your electronic needs, and experience the value and benefits that the MC74ACT541NG brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 8.5 ns

Fast propagation delay ensures quick signal transmission, making the product efficient for communication.

No. of Bits: 8

Provides a wide range of data communication options, suitable for various bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply makes it compatible with most systems and ensures consistent performance.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission and reception, improving overall product performance.

Power Supplies (V): 5

Standard power supply voltage for reliability and compatibility with a wide range of systems.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, adding versatility to the product's functionality.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function reliably in various environments and conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers MC74ACT541NG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74ACT541NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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