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MC33161PG

Onsemi

MC33161PG by Onsemi

MC33161PG by Onsemi is a power management IC with 1 function. It has a rectangular package shape and operates at temperatures ranging from -40 to 105°C. This IC is commonly used as a power supply support circuit in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 4,085 parts In-Stock

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Digiode

USA . 1,439 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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Cogito LLC

Ukraine . 54 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Benley Electronics

USA . 21 parts In-Stock

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$0.400

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$0.400

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Ampacity Inc.

Singapore . 881 parts In-Stock

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$3.500

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881

$3.500

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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$6.720

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500

$6.720

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AZTECH Wire

Italy . 286 parts In-Stock

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$10.763

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A-Z Elektronik GmbH

Germany . 4,562 parts In-Stock

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Continental Prestige Electronics

USA . 4,428 parts In-Stock

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Kulean Microsystems

USA . 4,279 parts In-Stock

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Argo Parts USA

USA . 3,525 parts In-Stock

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SupplyDigital Components

Austria . 3,123 parts In-Stock

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Problanco Electronics

Mexico . 2,418 parts In-Stock

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TANS Electronics

Latvia . 2,067 parts In-Stock

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Kepictronics

USA . 1,700 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 852 parts In-Stock

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852

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Microchip USA

USA . 439 parts In-Stock

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439

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Corohmni

South Africa . 338 parts In-Stock

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338

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Corphita

USA . 243 parts In-Stock

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Overview

Experience the quality and reliability of Onsemi with the MC33161PG Power Management IC. Designed for industrial applications, this versatile chip offers customers a wide range of benefits and advantages. With its durable plastic/epoxy body material and dual terminal position, this IC ensures optimal performance even in harsh environments. The MC33161PG's compact rectangular package shape and in-line style make it easy to integrate into any design. From power supply support circuits to various other applications, this Onsemi product is the perfect choice for your next project. Trust in Onsemi's expertise and unlock the full potential of your power management needs with the MC33161PG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and resistance to environmental factors, ensuring the longevity and reliability of the power management IC.

No. of Functions: 1

With a single function, this power management IC simplifies circuit design and reduces complexity, making it an efficient choice for power management applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various circuit designs, providing versatility and compatibility for different power management system configurations.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V, this power management IC offers compatibility with a wide range of electronic devices, making it suitable for multiple applications.

No. of Terminals: 8

The availability of 8 terminals enables efficient connection and interaction with external components, facilitating seamless integration and improved overall system performance.

Package Style (Meter): IN-LINE

The in-line package style enhances the ease of installation and maintenance, allowing for streamlined power management system assembly and reducing operational challenges.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in demanding heat-intensive environments, making this power management IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this power management IC is capable of functioning reliably in extreme cold conditions, expanding its range of potential applications.

Terminal Finish: Tin (Sn)

The use of tin as the terminal finish offers excellent solderability and corrosion resistance, enhancing the overall quality and lifespan of the power management IC.

Terminal Position: DUAL

The dual terminal position allows for flexible and efficient electrical connections, accommodating different circuit configurations and ensuring optimal power management functionality.

Maximum Seated Height: 4.45 mm

With a compact maximum seated height, this power management IC enables space-efficient design implementations, ensuring ease of integration and maximizing system compactness.

Width (mm): 7.62 mm

The narrow width of 7.62mm allows for space-saving installation, making this power management IC an ideal choice for applications where board real estate is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC acts as a power supply support circuit, assisting in voltage regulation, current control, and protection functions, making it an essential component for stable and efficient power management systems.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V, this power management IC offers flexibility in power source selection, enabling compatibility with various power supply options.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand a maximum time of 40 seconds at peak reflow temperature ensures the IC's robustness during the soldering process, enhancing manufacturing efficiency and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and bonding of the power management IC, contributing to a secure and durable electrical connection.

Length: 9.78 mm

With a compact length of 9.78mm, this power management IC maximizes space efficiency and allows for flexible integration into tight or constrained circuit layouts.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grade requirements, this power management IC is resistant to extreme temperatures and is suitable for rugged and demanding environments.

No. of Channels: 2

Providing two channels, this power management IC allows for simultaneous management and control of multiple power inputs or outputs, offering increased flexibility and functionality.

Technology: BIPOLAR

Utilizing bipolar technology, this power management IC delivers precise and efficient power regulation, enabling stable operation and steady voltage outputs for high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and reliable mounting on the circuit board, offering mechanical stability and ease of soldering, ensuring the overall reliability of the power management system.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54mm, this power management IC provides easy compatibility and standardization, simplifying integration into existing circuit designs or board layouts.

Maximum Supply Voltage (Vsup): 40 V

Capable of operating at a maximum supply voltage of 40V, this power management IC is suitable for applications requiring higher voltage capabilities, offering compatibility with a wide range of power systems.

Technical Specifications

Power Management ICs MC33161PG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

MINIMUM SUPPLY NEEDED FOR NEGATIVE SENSING IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC33161PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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