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MC14555BCPG

Onsemi

MC14555BCPG by Onsemi

MC14555BCPG by Onsemi is a CMOS Decoder & Drivers with 2 functions, 440 ns propagation delay at 5V. It has a package style of IN-LINE and operates in temperatures ranging from -55 to 125 °C. Ideal for military-grade applications requiring true output polarity and standard input conditioning.

Median Price

$0.431

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,904 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

$0.351

10k+ parts

$0.313

3,904

-

$0.423

$0.351

$0.313

Verical

USA . 2,656 parts In-Stock

1+ parts

-

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$0.439

10k+ parts

$0.391

2,656

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$0.439

$0.391

Distributors (In-Stock)

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Digiode

USA . 120 parts In-Stock

1+ parts

$0.330

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$0.330

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Vyrian

USA . 6,555 parts In-Stock

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South Electronics

USA . 719 parts In-Stock

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Connector Distribution Corp

USA . 29 parts In-Stock

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Right Parts Inc.

USA . 29 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Dan-Mar Components

USA . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,227 parts In-Stock

1+ parts

$0.312

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$0.312

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Corohmni

South Africa . 451 parts In-Stock

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$0.347

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451

$0.347

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AZTECH Wire

Italy . 327 parts In-Stock

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$9.610

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327

$9.610

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Kulean Microsystems

USA . 6,493 parts In-Stock

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Continental Prestige Electronics

USA . 6,108 parts In-Stock

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$0.298

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6,108

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$0.298

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,956 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,913 parts In-Stock

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SupplyDigital Components

Austria . 3,614 parts In-Stock

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TANS Electronics

Latvia . 1,858 parts In-Stock

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Kepictronics

USA . 445 parts In-Stock

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445

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UHIMA Technologies

Türkiye . 194 parts In-Stock

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Microchip USA

USA . 118 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Experience unparalleled performance with the MC14555BCPG by Onsemi, a top-tier manufacturer in the industry. This high-quality Decoder & Drivers product offers incredible value with its versatile applications and efficient design. Whether you're looking to enhance your electronics project or streamline your operations, this product delivers exceptional benefits and advantages to meet all your needs. Trust Onsemi for superior technology and reliability that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the decoder & drivers, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 440 ns

The low propagation delay ensures quick response time, making this product suitable for applications requiring fast data processing.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration of this product into existing circuit designs, reducing compatibility issues.

Nominal Supply Voltage / Vsup (V): 5

The consistent supply voltage of 5V ensures stable operation of the decoder & drivers, making it reliable in various environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments, increasing its versatility.

Technical Specifications

Decoder & Drivers MC14555BCPG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14555BCPG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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