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MC14076BCPG

Onsemi

MC14076BCPG by Onsemi

MC14076BCPG by Onsemi is a 4-bit latch with 600 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 3-18 V and can handle load capacitance of 50 pF. Ideal for military-grade applications requiring TRUE output polarity and POSITIVE EDGE triggering.

Median Price

$0.342

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

1+ parts

$0.710

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2

$0.710

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Rochester

USA . 5,240 parts In-Stock

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-

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$0.304

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$0.252

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$0.225

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$0.304

$0.252

$0.225

DigiKey

USA . 5,240 parts In-Stock

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$0.380

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$0.380

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Verical

USA . 1,550 parts In-Stock

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$0.281

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$0.281

Distributors (In-Stock)

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Digiode

USA . 886 parts In-Stock

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$0.237

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Vyrian

USA . 7,425 parts In-Stock

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Euro-Tech

UK . 1,304 parts In-Stock

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Component Sense

UK . 950 parts In-Stock

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$0.325

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$0.325

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$0.286

950

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$0.325

$0.325

$0.286

Bristol Electronics

USA . 326 parts In-Stock

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Atlantic Semiconductor

USA . 326 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 125 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 763 parts In-Stock

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$0.224

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Corohmni

South Africa . 386 parts In-Stock

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$0.238

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$0.238

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AZTECH Wire

Italy . 456 parts In-Stock

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$14.980

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Kepictronics

USA . 12,100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,123 parts In-Stock

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Continental Prestige Electronics

USA . 6,805 parts In-Stock

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$0.212

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Kulean Microsystems

USA . 6,584 parts In-Stock

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Microchip USA

USA . 5,729 parts In-Stock

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Problanco Electronics

Mexico . 5,674 parts In-Stock

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SupplyDigital Components

Austria . 3,971 parts In-Stock

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TANS Electronics

Latvia . 3,448 parts In-Stock

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UHIMA Technologies

Türkiye . 670 parts In-Stock

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Perfect Parts

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Overview

Experience unparalleled quality and reliability with the MC14076BCPG by Onsemi. As a leading manufacturer in latches & flip-flops, Onsemi delivers cutting-edge technology that guarantees top-notch performance. This versatile product offers customers seamless integration, high efficiency, and unmatched value. Ideal for a wide range of applications, the MC14076BCPG is the perfect choice for those looking for superior functionality and innovation. Trust Onsemi to provide you with the best in class solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the latch & flip-flop durable and lightweight, perfect for various applications.

No. of Bits: 4

Having 4 bits allows for precise and efficient operation, making this latch & flip-flop suitable for handling multiple data inputs.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with most standard electronic systems, making it a versatile choice for different projects.

Propagation Delay (tpd): 600 ns

The low propagation delay of 600ns ensures fast and efficient signal transmission, making the latch & flip-flop ideal for applications requiring quick response times.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this latch & flip-flop can withstand harsh environmental conditions without compromising performance.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, reducing the risk of errors in data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch & flip-flop energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops MC14076BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

1800000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

6 MHz

Trade Compliance

MC14076BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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