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MC14049UBCPG

Onsemi

MC14049UBCPG by Onsemi

MC14049UBCPG by Onsemi is a CMOS Logic Gates IC with 6 functions, 120 ns propagation delay at 5V. It has a package style of IN-LINE and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring fast signal processing within a temperature range.

Median Price

$0.500

Lifecycle Status

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Vyrian

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Zilex Electronics Inc.

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Bristol Electronics

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Atlantic Semiconductor

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Speed Components Ltd

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Extreme Components

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Component Sense

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Semi Source

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NexGen Digital

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Corohmni

South Africa . 225 parts In-Stock

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AZTECH Wire

Italy . 442 parts In-Stock

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SupplyDigital Components

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TANS Electronics

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Problanco Electronics

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Kepictronics

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Microchip USA

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UHIMA Technologies

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Overview

Enhance your electronic designs with the MC14049UBCPG by Onsemi, a top-quality logic gate that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product boasts a wide range of applications in various electronics projects. With its fast propagation delay and low power consumption, the MC14049UBCPG provides excellent value for customers looking to optimize their circuits. Upgrade your designs today with this versatile logic gate and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 120 ns

Low propagation delay ensures fast response times in logic operations.

No. of Functions: 6

Versatile product with multiple logic functions in a single package.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V supply systems.

Load Capacitance (CL): 50 pF

Allows for efficient operation with a specific load capacitance.

Power Supplies (V): 5/15

Flexibility in power supply options for the product.

No. of Terminals: 16

Sufficient terminals for connectivity and integration in circuit designs.

Maximum I (ol): 6 Amp

High current output capability for driving external loads.

Maximum Operating Temperature: 125 °C

Can operate reliably at high temperatures, suitable for various environments.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme conditions.

Terminal Finish: Tin (Sn)

Corrosion-resistant terminal finish for long-term reliability.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminals for secure and reliable connections in circuit boards.

Technical Specifications

Logic Gates MC14049UBCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

120 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14049UBCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-630-4167, 5962016304167

NIIN

016304167

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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