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MC14043BFELG

Onsemi

MC14043BFELG by Onsemi

MC14043BFELG by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It has a true output polarity, operates in the temperature range of -55 to 125 °C, and is suitable for military-grade applications. The small outline package style with gull wing terminals makes it ideal for surface mount designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,976 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 720 parts In-Stock

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Microchip USA

USA . 4,852 parts In-Stock

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TANS Electronics

Latvia . 4,104 parts In-Stock

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Problanco Electronics

Mexico . 3,269 parts In-Stock

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Kulean Microsystems

USA . 3,072 parts In-Stock

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SupplyDigital Components

Austria . 1,503 parts In-Stock

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Corphita

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Corohmni

South Africa . 430 parts In-Stock

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UHIMA Technologies

Türkiye . 409 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MC14043BFELG by Onsemi, a top-tier manufacturer known for quality and reliability. As part of the Latches & Flip-Flops category, this product offers seamless integration and high performance in various applications. Experience the value of fast propagation delay, 3-STATE output characteristics, and true output polarity, all while benefiting from a compact package design and versatile terminal options. Trust in Onsemi to deliver innovation and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the latch or flip-flop, making it suitable for long-term use.

Propagation Delay At Nominal Supply: 350 ns

With a fast propagation delay of 350 ns at nominal supply voltage, this latch or flip-flop can quickly respond to input changes, enhancing performance.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this latch or flip-flop is compatible with a wide range of electronic systems.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the latch or flip-flop to be in a high impedance state when not actively driving a signal, reducing power consumption and preventing signal conflicts.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this latch or flip-flop is highly reliable and suitable for use in harsh environments or critical applications.

Technology: CMOS

Utilizing CMOS technology, this latch or flip-flop offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for electronic circuits.

Technical Specifications

Latches & Flip-Flops MC14043BFELG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

5.275 mm

Trade Compliance

MC14043BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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