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MC14042BDG

Onsemi

MC14042BDG by Onsemi

MC14042BDG by Onsemi is a 4-bit latch with 440 ns propagation delay at 5V. It operates in temperatures from -55 to 125 °C, suitable for military-grade applications. With a small outline package and surface mount capability, it's ideal for compact electronic designs.

Median Price

$0.310

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,792 parts In-Stock

1+ parts

$0.310

100+ parts

$0.300

1k+ parts

$0.300

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10,792

$0.310

$0.300

$0.300

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Flip Electronics (Authorized)

USA . 1,344 parts In-Stock

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1,344

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Distributors (In-Stock)

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Digiode

USA . 965 parts In-Stock

1+ parts

$0.294

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965

$0.294

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Component Electronics Inc.

Canada . 648 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

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648

$1.150

$0.870

$0.750

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Vyrian

USA . 6,510 parts In-Stock

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Flip Electronics

USA . 1,344 parts In-Stock

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1,344

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Bristol Electronics

USA . 786 parts In-Stock

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786

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Inventory MP

USA . 567 parts In-Stock

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567

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PC Components Company LLC

USA . 219 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 241 parts In-Stock

1+ parts

$0.279

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241

$0.279

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Corohmni

South Africa . 424 parts In-Stock

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$0.310

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424

$0.310

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AZTECH Wire

Italy . 104 parts In-Stock

1+ parts

$16.800

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104

$16.800

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Microchip USA

USA . 8,106 parts In-Stock

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Kulean Microsystems

USA . 7,222 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,830 parts In-Stock

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Perfect Parts

USA . 6,066 parts In-Stock

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Problanco Electronics

Mexico . 4,721 parts In-Stock

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4,721

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TANS Electronics

Latvia . 4,460 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,330 parts In-Stock

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SupplyDigital Components

Austria . 1,090 parts In-Stock

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Metaverse IC Inc.

Canada . 207 parts In-Stock

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Overview

Discover the MC14042BDG by Onsemi, a top-quality latches & flip-flops component that offers unparalleled reliability and performance. With Onsemi's reputation for excellence in manufacturing, this product is designed to meet the highest industry standards. Ideal for a wide range of applications, this component provides customers with unmatched value, benefits, and advantages. Experience seamless operation and efficiency with the MC14042BDG, making it a must-have for any project requiring precision and stability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for electronic applications.

Propagation Delay At Nominal Supply: 440 ns

The low propagation delay ensures fast operation, making this latch & flip-flop suitable for applications requiring quick response times.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this latch & flip-flop compatible with a wide range of electronic systems.

Trigger Type: HIGH LEVEL

The high-level trigger type ensures stable and reliable operation in digital systems, minimizing the risk of false triggering.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, making this latch & flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC14042BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

MC14042BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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