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MC14013BDTR2

Onsemi

MC14013BDTR2 by Onsemi

MC14013BDTR2 by Onsemi is a CMOS latches & flip-flops IC with 350ns propagation delay at 5V. It has 2 functions, operates in -55 to 125 °C range, and supports up to 18V supply voltage. Ideal for military-grade applications requiring fast response time and low power consumption.

Median Price

$0.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,550 parts In-Stock

1+ parts

$0.170

100+ parts

$0.170

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$0.160

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3,550

$0.170

$0.170

$0.160

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Chip Stock

USA . 26,500 parts In-Stock

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Vyrian

USA . 7,426 parts In-Stock

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Digiode

USA . 2,401 parts In-Stock

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Speed Components Ltd

Israel . 86 parts In-Stock

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AZTECH Wire

Italy . 151 parts In-Stock

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$20.490

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151

$20.490

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Kulean Microsystems

USA . 7,113 parts In-Stock

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Problanco Electronics

Mexico . 5,825 parts In-Stock

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SupplyDigital Components

Austria . 3,579 parts In-Stock

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TANS Electronics

Latvia . 2,521 parts In-Stock

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Corphita

USA . 1,382 parts In-Stock

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UHIMA Technologies

Türkiye . 935 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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Microchip USA

USA . 195 parts In-Stock

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Overview

Enhance your electronic projects with the MC14013BDTR2 by Onsemi, a premium-quality latches & flip-flops component that guarantees reliable performance. Manufactured by industry leader Onsemi, this product offers unparalleled value and benefits to customers looking for efficient solutions in their applications. With a wide range of functions and a compact package design, the MC14013BDTR2 is perfect for various projects where precision and durability are paramount. Upgrade your projects today with this high-quality component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay At Nominal Supply: 350 ns

Fast propagation delay ensures efficient operation and response time.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Allows for multiple operations or functions within a single component.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement that is widely available and compatible with most systems.

Load Capacitance (CL): 50 pF

Optimal capacitance for efficient performance and signal transmission.

Power Supplies (V): 5/15

Compatible with both 5V and 15V power supplies, offering versatility in usage.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for operation in challenging environments.

Trigger Type: POSITIVE EDGE

Specific trigger type for precise and accurate signal triggering.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Latches & Flip-Flops MC14013BDTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

7 MHz

Trade Compliance

MC14013BDTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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