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MC10SX1189DR2G

Onsemi

MC10SX1189DR2G by Onsemi

MC10SX1189DR2G by Onsemi is a Line Transceiver with 16 terminals, operating at -40 to 85 °C. It offers differential output, 0.65 ns max transmit delay, and 0.5 ns max receive delay. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$5.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,128 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.510

10k+ parts

$4.250

2,128

-

$5.040

$4.510

$4.250

Verical

USA . 2,128 parts In-Stock

1+ parts

-

100+ parts

$6.300

1k+ parts

$5.638

10k+ parts

-

2,128

-

$6.300

$5.638

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 373 parts In-Stock

1+ parts

$5.339

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$5.339

-

-

-

Vyrian

USA . 7,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,159

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 466 parts In-Stock

1+ parts

$5.058

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$5.058

-

-

-

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$5.620

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$5.620

-

-

-

AZTECH Wire

Italy . 1,113 parts In-Stock

1+ parts

$17.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

$17.140

-

-

-

TANS Electronics

Latvia . 7,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,496

-

-

-

-

SupplyDigital Components

Austria . 6,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,015

-

-

-

-

Problanco Electronics

Mexico . 3,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

-

-

-

-

Continental Prestige Electronics

USA . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.060

10k+ parts

-

2,128

-

-

$5.060

-

Kulean Microsystems

USA . 2,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,110

-

-

-

-

UHIMA Technologies

Türkiye . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

259

-

-

-

-

Microchip USA

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252

-

-

-

-

Overview

Experience seamless and reliable data transmission with the MC10SX1189DR2G by Onsemi. Crafted by a renowned manufacturer, this line driver & receiver offers exceptional quality and performance. Perfect for industrial applications, this product ensures smooth operation even in challenging conditions. Trust Onsemi to provide innovative solutions that deliver value and efficiency. Upgrade your systems with the MC10SX1189DR2G and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltages, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Compact design that efficiently utilizes space on the circuit board.

Maximum Transmit Delay: 0.65 ns

Provides fast transmission speed, ensuring efficient data transfer.

No. of Terminals: 16

Offers versatility in connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE

Space-saving design that allows for compact integration into electronic devices.

Minimum Supply Voltage: 4.5 V

Wide operating voltage range ensures compatibility with different power sources.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish: TIN

Provides corrosion resistance and good conductivity for reliable connections.

Terminal Position: DUAL

Enhances signal integrity and ease of connection in the circuit.

Maximum Seated Height: 1.75 mm

Low-profile design for space-constrained applications.

Width: 3.9 mm

Compact form factor for efficient use of board space.

Differential Output: YES

Allows for robust noise immunity and signal integrity in high-speed data transmission.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes during manufacturing.

Length: 9.9 mm

Optimal size for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and reliability requirements.

Maximum Receive Delay: 0.5 ns

Provides low latency for receiving data, ensuring quick response times.

Terminal Form: GULL WING

Facilitates easy soldering onto the circuit board for secure connections.

Input Characteristics: DIFFERENTIAL

Enables noise rejection and high signal integrity in data transmission.

Nominal Supply Voltage: 5 V

Standard operating voltage for compatibility with common power sources.

Terminal Pitch: 1.27 mm

Optimal spacing between terminals for ease of soldering and board layout.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for line driver and receiver applications, ensuring reliable data transmission.

Technical Specifications

Line Drivers & Receivers MC10SX1189DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.65 ns

Width:

3.9 mm

Trade Compliance

MC10SX1189DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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