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MC10H116FNR2G

Onsemi

MC10H116FNR2G by Onsemi

MC10H116FNR2G by Onsemi is a Line Driver & Receiver with 3 functions, ECL technology, and -5.2V power supply. It has 20 terminals in a square chip carrier package suitable for commercial extended temperature applications. The receiver features differential output and operates at temperatures ranging from 0 to 75 °C, making it ideal for high-speed communication systems.

Median Price

$2.765

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 17,000 parts In-Stock

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Verical

USA . 490 parts In-Stock

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$3.000

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490

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$3.000

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Rochester

USA . 53 parts In-Stock

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$2.530

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$2.260

10k+ parts

$2.130

53

-

$2.530

$2.260

$2.130

Distributors (In-Stock)

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Digiode

USA . 99 parts In-Stock

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$2.679

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99

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USA . 17,000 parts In-Stock

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Vyrian

USA . 7,361 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 800 parts In-Stock

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800

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A&K Electronics

USA . 360 parts In-Stock

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360

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ComSIT Distribution GmbH

Germany . 295 parts In-Stock

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EMSNET

USA . 175 parts In-Stock

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Bristol Electronics

USA . 31 parts In-Stock

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Microfarads

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Distributors (Availability)

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Corohmni

South Africa . 194 parts In-Stock

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$2.360

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Corphita

USA . 1,095 parts In-Stock

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$2.538

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Component Stockers USA

USA . 59 parts In-Stock

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$2.900

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Lixinc

USA . 19,329 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,734 parts In-Stock

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SupplyDigital Components

Austria . 8,037 parts In-Stock

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Microchip USA

USA . 5,556 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,445 parts In-Stock

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Kepictronics

USA . 2,122 parts In-Stock

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Metaverse IC Inc.

Canada . 2,122 parts In-Stock

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Problanco Electronics

Mexico . 1,089 parts In-Stock

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Kulean Microsystems

USA . 936 parts In-Stock

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UHIMA Technologies

Türkiye . 670 parts In-Stock

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Perfect Parts

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ChipstoGo Electronic ltd

UK . 419 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 60 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the MC10H116FNR2G by Onsemi. Known for their top-quality products, Onsemi delivers innovative solutions in the Line Drivers & Receivers category. This chip carrier package offers customers reliability, efficiency, and high performance. With a wide range of applications, this line receiver provides seamless integration into various systems, ensuring optimal functionality. Upgrade your electronics with Onsemi's MC10H116FNR2G and experience the difference in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in one device simplifies the circuit design and saves on component costs.

Power Supplies (V): -5.2

The negative power supply voltage of -5.2V is suitable for many industrial applications.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technology: ECL

ECL (Emitter-Coupled Logic) technology provides high-speed operation and low power consumption, ideal for demanding applications.

Technical Specifications

Line Drivers & Receivers MC10H116FNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

1.3 ns

Receiver No. of Bits:

3

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H116FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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