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MC10H116FNG

Onsemi

MC10H116FNG by Onsemi

MC10H116FNG by Onsemi is a Line Receiver IC with 3 functions, ECL technology, and -5.2V supply voltage. It operates in commercial extended temperature range of 0-75°C, has 20 terminals in a chip carrier package, and offers differential output for high-speed applications.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 27 parts In-Stock

1+ parts

$4.660

100+ parts

$3.960

1k+ parts

$2.922

10k+ parts

$2.464

27

$4.660

$3.960

$2.922

$2.464

Newark

USA . 330 parts In-Stock

1+ parts

$5.060

100+ parts

$3.290

1k+ parts

$2.750

10k+ parts

-

330

$5.060

$3.290

$2.750

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Arrow

USA . 32 parts In-Stock

1+ parts

$6.031

100+ parts

-

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32

$6.031

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Rochester

USA . 9,039 parts In-Stock

1+ parts

-

100+ parts

$2.530

1k+ parts

$2.260

10k+ parts

$2.130

9,039

-

$2.530

$2.260

$2.130

Verical

USA . 9,039 parts In-Stock

1+ parts

-

100+ parts

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$2.825

10k+ parts

$2.663

9,039

-

-

$2.825

$2.663

Avnet

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$2.164

1k+ parts

$2.053

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96

-

$2.164

$2.053

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Future Electronics

Canada . 5 parts In-Stock

1+ parts

-

100+ parts

$2.880

1k+ parts

$2.770

10k+ parts

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5

-

$2.880

$2.770

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 587 parts In-Stock

1+ parts

$2.679

100+ parts

-

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587

$2.679

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Vyrian

USA . 6,765 parts In-Stock

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6,765

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Flip Electronics

USA . 6,302 parts In-Stock

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6,302

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ACDS - Activité Composants Distribution Service

France . 191 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 181 parts In-Stock

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181

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Semi Source

USA . 157 parts In-Stock

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157

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Manotoh

Italy . 104 parts In-Stock

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104

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Nova Conductors

Japan . 83 parts In-Stock

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83

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ComSIT Distribution GmbH

Germany . 46 parts In-Stock

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46

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LIBRA Elektronik GmbH

Germany . 46 parts In-Stock

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46

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Martec Srl

Italy . 42 parts In-Stock

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42

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A&K Electronics

USA . 34 parts In-Stock

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34

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ECAB

Sweden . 27 parts In-Stock

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27

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Bristol Electronics

USA . 12 parts In-Stock

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12

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Inventory MP

USA . 10 parts In-Stock

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10

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North Shore Components

USA . 5 parts In-Stock

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5

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IBS Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$4.039

1k+ parts

$3.885

10k+ parts

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5

-

$4.039

$3.885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,020 parts In-Stock

1+ parts

$2.538

100+ parts

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1,020

$2.538

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Corohmni

South Africa . 201 parts In-Stock

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$2.820

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201

$2.820

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AZTECH Wire

Italy . 710 parts In-Stock

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$18.270

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710

$18.270

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TANS Electronics

Latvia . 7,722 parts In-Stock

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Problanco Electronics

Mexico . 7,599 parts In-Stock

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7,599

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Kulean Microsystems

USA . 7,550 parts In-Stock

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Microchip USA

USA . 4,666 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,469 parts In-Stock

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2,469

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 230 parts In-Stock

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230

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Futuretech Components

Singapore . 193 parts In-Stock

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193

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Kepictronics

USA . 193 parts In-Stock

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193

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Assy Fe

Spain . 181 parts In-Stock

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181

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Perfect Parts

USA . 170 parts In-Stock

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170

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Overview

Discover new possibilities with the MC10H116FNG by Onsemi, a cutting-edge line driver and receiver that delivers unparalleled quality and performance. Crafted by Onsemi, a trusted manufacturer known for innovative solutions, this product offers seamless integration and reliable operation in a wide range of applications. From telecommunications to industrial automation, this versatile device provides value, benefits, and advantages that will exceed your expectations. Upgrade your systems today with the MC10H116FNG and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 3

Offers multiple functions in a single device, making it a versatile and cost-effective solution for various applications.

Power Supplies (V): -5.2

Provides a stable power supply for the device to function properly, ensuring reliable performance.

Maximum Operating Temperature: 75 °C

Can operate effectively in high-temperature environments, making it suitable for a wide range of industrial applications.

Terminal Finish: MATTE TIN

Enhances corrosion resistance and solderability, ensuring a secure connection and long-lasting performance.

Receiver No. of Bits: 3

Allows for precise signal reception and processing, ensuring accurate data transmission.

Technology: ECL

Utilizes ECL technology for high-speed and low-power operation, making it ideal for applications where speed and efficiency are crucial.

Technical Specifications

Line Drivers & Receivers MC10H116FNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

1.3 ns

Receiver No. of Bits:

3

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H116FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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