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MC10H115MELG

Onsemi

MC10H115MELG by Onsemi

MC10H115MELG by Onsemi is a Line Receiver IC with 4 functions, operating at -5.2V. It features ECL technology, 1.3ns max receive delay, and 29mA max supply current. Ideal for applications requiring high-speed signal transmission in commercial environments.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76,486 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

76,486

-

$2.190

$1.960

$1.850

Verical

USA . 70,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

70,733

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 763 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$2.328

-

-

-

DigiKey Marketplace

USA . 76,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76,486

-

-

-

-

Vyrian

USA . 4,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,764

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 299 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$2.205

-

-

-

Corohmni

South Africa . 120 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$2.450

-

-

-

Component Stockers USA

USA . 77,200 parts In-Stock

1+ parts

$2.520

100+ parts

$2.370

1k+ parts

$2.140

10k+ parts

$2.140

77,200

$2.520

$2.370

$2.140

$2.140

AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$12.630

100+ parts

-

1k+ parts

-

10k+ parts

-

639

$12.630

-

-

-

Continental Prestige Electronics

USA . 76,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.990

10k+ parts

-

76,486

-

-

$3.990

-

GreenTree Electronics

Israel . 19,016 parts In-Stock

1+ parts

-

100+ parts

-

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19,016

-

-

-

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Microchip USA

USA . 6,549 parts In-Stock

1+ parts

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100+ parts

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6,549

-

-

-

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SupplyDigital Components

Austria . 5,106 parts In-Stock

1+ parts

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100+ parts

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5,106

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-

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TANS Electronics

Latvia . 4,337 parts In-Stock

1+ parts

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100+ parts

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4,337

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-

-

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Problanco Electronics

Mexico . 3,404 parts In-Stock

1+ parts

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100+ parts

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3,404

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Kulean Microsystems

USA . 854 parts In-Stock

1+ parts

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854

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UHIMA Technologies

Türkiye . 16 parts In-Stock

1+ parts

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16

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Overview

Enhance your communication systems with the MC10H115MELG by Onsemi, a high-quality line driver & receiver designed to deliver reliable performance in various applications. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust in the durability and precision of this product. From industrial automation to telecommunications, this versatile component offers exceptional value by providing seamless signal transmission and unmatched efficiency. Upgrade your technology with the MC10H115MELG and experience the advantages of cutting-edge connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional parts and simplifying the design.

Power Supplies (V): -5.2

Operates at a negative supply voltage, suitable for applications requiring low power consumption.

Maximum Operating Temperature: 75 °C

Can withstand high temperatures, making it suitable for use in various environments.

Receiver No. of Bits: 4

Provides accurate data transmission with 4 bits communication capability.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power operation.

Technical Specifications

Line Drivers & Receivers MC10H115MELG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

1.3 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2.05 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

29 mA

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H115MELG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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