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MC10EP16VADTR2G

Onsemi

MC10EP16VADTR2G by Onsemi

MC10EP16VADTR2G by Onsemi is a Line Driver with 5.5V max supply voltage, 0.34ns max transmit delay, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring ECL technology, it features differential output and GULL WING terminal form in a small outline package.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

4,900

-

$3.740

$3.350

$3.150

Verical

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

-

4,900

-

$4.675

$4.188

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 537 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$3.962

-

-

-

Vyrian

USA . 8,292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,292

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$3.750

-

-

-

Corphita

USA . 1,683 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$3.753

-

-

-

AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$11.730

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$11.730

-

-

-

TANS Electronics

Latvia . 7,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,962

-

-

-

-

Problanco Electronics

Mexico . 7,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,178

-

-

-

-

SupplyDigital Components

Austria . 6,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,238

-

-

-

-

Continental Prestige Electronics

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.750

10k+ parts

-

4,900

-

-

$3.750

-

Kulean Microsystems

USA . 1,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,366

-

-

-

-

UHIMA Technologies

Türkiye . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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338

-

-

-

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Microchip USA

USA . 128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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128

-

-

-

-

Overview

Enhance your electronic designs with the MC10EP16VADTR2G from Onsemi, a leading manufacturer known for superior quality and reliability. This line driver & receiver offers fast transmit and receive delays, differential output, and industrial-grade temperature tolerance. Perfect for applications requiring precise signal transmission, this product provides unmatched value and performance. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the MC10EP16VADTR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of input voltages, making the product versatile and compatible with various systems.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs and provides a standardized form factor for compatibility.

Maximum Transmit Delay: 0.34 ns

Ensures fast and efficient data transmission, ideal for applications where speed is critical.

Power Supplies (V): -5.2

Supports dual power supplies, providing flexibility in power configurations for different applications.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-saving designs, ideal for applications with limited board space.

Maximum High Level Input Current: 0.00015 Amp

Efficiently handles input currents, ensuring reliability and stability in operation.

Minimum Supply Voltage: 3 V

Works with low voltage systems, making it compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Operates effectively in cold environments, providing reliability in harsh conditions.

Terminal Finish: TIN

Offers corrosion resistance and good electrical conductivity for reliable connections.

Terminal Position: DUAL

Provides redundancy and flexibility in connection options for different system configurations.

Maximum Seated Height: 1.1 mm

Low-profile design saves space and allows for compact device integration.

Width: 3 mm

Compact width allows for efficient use of board space and easy integration into tight layouts.

Differential Output: YES

Delivers accurate and noise-immune signaling, ensuring reliable data transmission over long distances.

Technical Specifications

Line Drivers & Receivers MC10EP16VADTR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.34 ns

Width:

3 mm

Trade Compliance

MC10EP16VADTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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