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MC10EP16VADR2G

Onsemi

MC10EP16VADR2G by Onsemi

MC10EP16VADR2G by Onsemi is a Line Driver with 5.5V max supply voltage, 0.34ns max transmit delay, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring ECL technology for high-speed differential signal transmission in compact designs.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,980 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

14,980

-

$3.740

$3.350

$3.150

Verical

USA . 14,980 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

14,980

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 873 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

873

$3.962

-

-

-

Vyrian

USA . 6,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,414

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 196 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$3.750

-

-

-

Corphita

USA . 947 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

947

$3.753

-

-

-

Component Stockers USA

USA . 21,236 parts In-Stock

1+ parts

$4.270

100+ parts

$4.010

1k+ parts

$3.620

10k+ parts

$3.620

21,236

$4.270

$4.010

$3.620

$3.620

AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$14.590

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$14.590

-

-

-

Continental Prestige Electronics

USA . 14,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.750

10k+ parts

-

14,980

-

-

$3.750

-

SupplyDigital Components

Austria . 8,161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,161

-

-

-

-

Problanco Electronics

Mexico . 6,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,786

-

-

-

-

Kepictronics

USA . 5,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,050

-

-

-

-

Kulean Microsystems

USA . 4,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,365

-

-

-

-

TANS Electronics

Latvia . 863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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863

-

-

-

-

Microchip USA

USA . 487 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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487

-

-

-

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UHIMA Technologies

Türkiye . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49

-

-

-

-

Overview

Enhance your electronic systems with the MC10EP16VADR2G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality line drivers & receivers that provide reliable and efficient data transmission. This versatile component is perfect for a wide range of applications, offering customers superior performance, precision, and durability. Experience seamless communication and enhanced functionality with the MC10EP16VADR2G, designed to meet all your needs with ease. Elevate your projects with the exceptional value and benefits this product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort in manufacturing.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage, making it versatile for various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Transmit Delay: 0.34 ns

Fast transmit delay ensures quick and efficient data transmission.

Power Supplies (V): -5.2

Can operate effectively with a negative supply voltage, suitable for certain industrial applications.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board.

Maximum High Level Input Current: 0.00015 Amp

Low input current helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 3 V

Can operate at a low supply voltage, ideal for applications with limited power availability.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational even at very low temperatures, suitable for a wide range of operating conditions.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for the terminals.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connection.

Maximum Seated Height: 1.75 mm

Low seated height saves vertical space on the circuit board.

Width: 3.9 mm

Narrow width fits well in compact electronic devices.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a sufficient time during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperature during soldering process.

Length: 4.9 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in harsh environments.

Maximum Receive Delay: 0.34 ns

Fast receive delay ensures quick processing of incoming data signals.

Technology: ECL

ECL technology provides high-speed and low-power operation for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and robust connection.

Maximum Supply Current: 40 mA

Low supply current requirement for efficient power consumption.

Input Characteristics: DIFFERENTIAL

Differential input helps in noise rejection and signal accuracy.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance.

Nominal Negative Supply Voltage: -5.2 V

Stable negative supply voltage for reliable operation in dual supply systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various circuit board layouts.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for line transceiver applications, ensuring optimal signal transfer.

Technical Specifications

Line Drivers & Receivers MC10EP16VADR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.34 ns

Width:

3.9 mm

Trade Compliance

MC10EP16VADR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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