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MC10EP16TDTR2G

Onsemi

MC10EP16TDTR2G by Onsemi

MC10EP16TDTR2G by Onsemi is a Line Driver with 3.3V nominal voltage, -5.2V negative supply voltage, and 0.3ns max transmit delay. It is used in industrial applications requiring ECL technology for high-speed differential signal transmission.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,361 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

7,361

-

$5.610

$5.020

$4.720

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

-

5,000

-

$7.013

$6.275

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,087 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$5.938

-

-

-

Vyrian

USA . 2,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,249

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 169 parts In-Stock

1+ parts

$5.625

100+ parts

-

1k+ parts

-

10k+ parts

-

169

$5.625

-

-

-

Corohmni

South Africa . 398 parts In-Stock

1+ parts

$6.250

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$6.250

-

-

-

Component Stockers USA

USA . 8,864 parts In-Stock

1+ parts

$6.370

100+ parts

$5.990

1k+ parts

$5.420

10k+ parts

-

8,864

$6.370

$5.990

$5.420

-

AZTECH Wire

Italy . 210 parts In-Stock

1+ parts

$13.280

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$13.280

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,776

-

-

-

-

Continental Prestige Electronics

USA . 7,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.620

10k+ parts

-

7,361

-

-

$5.620

-

SupplyDigital Components

Austria . 6,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,570

-

-

-

-

Microchip USA

USA . 4,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,629

-

-

-

-

Problanco Electronics

Mexico . 2,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,493

-

-

-

-

Kulean Microsystems

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

-

-

-

-

TANS Electronics

Latvia . 1,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,132

-

-

-

-

UHIMA Technologies

Türkiye . 285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

285

-

-

-

-

Overview

Experience unmatched performance and reliability with the MC10EP16TDTR2G by Onsemi, a leading manufacturer in the industry. This line driver and receiver is designed to deliver seamless communication in a variety of applications, ensuring smooth data transmission and reception. Its compact design and high-quality construction make it a valuable asset for any project. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your systems with the MC10EP16TDTR2G and enjoy unparalleled efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides a lightweight and durable package for the line driver and receiver, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this line driver & receiver can operate reliably in systems with varying power requirements.

Maximum Transmit Delay: 0.3 ns

The low transmit delay ensures fast and efficient data transmission, making it ideal for high-speed communication applications.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, enabling the device to interface with different components in a circuit.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for use in harsh environmental conditions, ensuring reliability in various settings.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this line driver & receiver efficient and reliable for demanding applications.

Technical Specifications

Line Drivers & Receivers MC10EP16TDTR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.3 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

31 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.3 ns

Width:

3 mm

Trade Compliance

MC10EP16TDTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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