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MC10EP16DG

Onsemi

MC10EP16DG by Onsemi

MC10EP16DG by Onsemi is a Line Driver & Receiver with ECL technology. It operates at -40 to 85 °C, with 3-5.5 V supply voltage range and 0.28 ns transmit/receive delay. Ideal for industrial applications requiring differential input/output characteristics in a compact SMD package.

Median Price

$6.929

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 785 parts In-Stock

1+ parts

$8.270

100+ parts

$5.330

1k+ parts

$4.750

10k+ parts

$4.740

785

$8.270

$5.330

$4.750

$4.740

DigiKey

USA . 210 parts In-Stock

1+ parts

$8.270

100+ parts

$5.441

1k+ parts

$5.015

10k+ parts

$4.912

210

$8.270

$5.441

$5.015

$4.912

Rochester

USA . 31,470 parts In-Stock

1+ parts

-

100+ parts

$4.470

1k+ parts

$4.000

10k+ parts

$3.770

31,470

-

$4.470

$4.000

$3.770

Verical

USA . 12,788 parts In-Stock

1+ parts

-

100+ parts

$5.588

1k+ parts

$5.000

10k+ parts

$4.713

12,788

-

$5.588

$5.000

$4.713

Flip Electronics (Authorized)

USA . 6,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,310

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,556 parts In-Stock

1+ parts

$4.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,556

$4.722

-

-

-

Flip Electronics

USA . 19,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,246

-

-

-

-

Vyrian

USA . 7,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,417

-

-

-

-

Bristol Electronics

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Connect4Technologies Inc.

Canada . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Cogito LLC

Ukraine . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

R&J Components

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Semtec, LLC

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,486 parts In-Stock

1+ parts

$4.473

100+ parts

-

1k+ parts

-

10k+ parts

-

1,486

$4.473

-

-

-

Corohmni

South Africa . 206 parts In-Stock

1+ parts

$4.970

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$4.970

-

-

-

Kulean Microsystems

USA . 7,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,887

-

-

-

-

TANS Electronics

Latvia . 7,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,093

-

-

-

-

Problanco Electronics

Mexico . 5,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,366

-

-

-

-

SupplyDigital Components

Austria . 1,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,458

-

-

-

-

UHIMA Technologies

Türkiye . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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320

-

-

-

-

Perfect Parts

USA . 217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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217

-

-

-

-

Overview

Experience unparalleled performance and reliability with the MC10EP16DG from Onsemi, a leading manufacturer in the industry. This line driver & receiver offers seamless communication and precision timing for a wide range of applications. With its high-quality construction and cutting-edge technology, this product ensures optimal functionality in industrial settings. Elevate your projects with the MC10EP16DG and enjoy the benefits of seamless data transmission and efficient operation. Trust Onsemi to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources, making it versatile for various applications.

Minimum Operating Temperature: -40 °C

Can operate effectively in low temperature environments, ensuring reliable performance in various conditions.

Maximum Transmit Delay: 0.28 ns

Enables fast transmission of signals, reducing latency and improving efficiency in data transmission.

Interface IC Type: LINE TRANSCEIVER

Utilizes a line transceiver interface IC for efficient data transmission between different systems, ensuring compatibility and reliability.

Technical Specifications

Line Drivers & Receivers MC10EP16DG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.28 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.28 ns

Width:

3.9 mm

Trade Compliance

MC10EP16DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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