Loading...

DS10BR150TSDX/NOPB

Texas Instruments

DS10BR150TSDX/NOPB by Texas Instruments

DS10BR150TSDX/NOPB by Texas Instruments is a Line Transceiver with 3.3V supply, 0.6ns max transmit/receive delay, and operates in -40 to 85°C range. Ideal for industrial applications requiring differential input characteristics and a compact chip carrier package.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,202 parts In-Stock

1+ parts

$1.350

100+ parts

$1.320

1k+ parts

$1.300

10k+ parts

-

6,202

$1.350

$1.320

$1.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

831

-

-

-

-

Anansix

USA . 591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

591

-

-

-

-

Digiode

USA . 553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

553

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 156 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

156

$1.500

-

-

-

Aztec Data Supply Inc.

USA . 4,443 parts In-Stock

1+ parts

$2.812

100+ parts

-

1k+ parts

-

10k+ parts

-

4,443

$2.812

-

-

-

Parana Technologies

USA . 1,196 parts In-Stock

1+ parts

$4.859

100+ parts

-

1k+ parts

$5.384

10k+ parts

-

1,196

$4.859

-

$5.384

-

ChromeModa Solutions

Germany . 4,969 parts In-Stock

1+ parts

$5.460

100+ parts

$4.477

1k+ parts

-

10k+ parts

-

4,969

$5.460

$4.477

-

-

IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$5.460

100+ parts

-

1k+ parts

$4.914

10k+ parts

-

499

$5.460

-

$4.914

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$5.600

100+ parts

$5.320

1k+ parts

$5.320

10k+ parts

-

50

$5.600

$5.320

$5.320

-

AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$18.157

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$18.157

-

-

-

Ampacity Inc.

Singapore . 858 parts In-Stock

1+ parts

$41.500

100+ parts

-

1k+ parts

-

10k+ parts

-

858

$41.500

-

-

-

Semicontronic

India . 455 parts In-Stock

1+ parts

$46.500

100+ parts

$45.338

1k+ parts

$45.105

10k+ parts

-

455

$46.500

$45.338

$45.105

-

Continental Prestige Electronics

USA . 4,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,084

-

-

-

-

Corphita

USA . 2,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

-

-

-

-

DigiPath Technology Company

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

$4.923

1k+ parts

-

10k+ parts

-

2,016

-

$4.923

-

-

Argo Parts USA

USA . 1,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,247

-

-

-

-

Microchip USA

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

402

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience seamless and reliable data transmission with the DS10BR150TSDX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides top-quality line drivers & receivers that cater to a wide range of applications. The DS10BR150TSDX/NOPB offers unparalleled value and benefits to customers, delivering high performance and efficiency. Trust Texas Instruments for cutting-edge technology that enhances your systems and processes. Choose the DS10BR150TSDX/NOPB for superior quality and reliability in data transmission solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line drivers and receivers, making it reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during production and providing a compact design.

Maximum Supply Voltage: 3.6 V

Can handle high voltage levels, ensuring stable and consistent performance even in demanding applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards, making it suitable for applications with limited space constraints.

Maximum Transmit Delay: 0.6 ns

Low transmit delay ensures fast signal transmission, reducing latency and improving overall system performance.

Power Supplies (V): 3.3

Operates on a common voltage level, making it compatible with a wide range of applications and easy to integrate into existing systems.

No. of Terminals: 8

Sufficient number of terminals for connecting to external devices and components, offering flexibility in system design and connectivity.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles provide options for different mounting and cooling requirements, ensuring compatibility with various system configurations.

Minimum Supply Voltage: 3 V

Can operate reliably even at low voltage levels, making it suitable for applications where power efficiency is essential.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance allows for operation in harsh environments without risking damage or performance degradation.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions, making it suitable for outdoor or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance, ensuring stable signal transmission and longevity of the product.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to external circuitry, minimizing the risk of loose connections or signal interference.

Maximum Seated Height: 0.8 mm

Low profile design allows for a compact form factor, ideal for applications where space is limited and height constraints exist.

Width: 3 mm

Narrow width makes it suitable for applications with limited board space, offering flexibility in system layout and design.

Differential Output: YES

Differential output ensures noise immunity and signal integrity, making it ideal for applications where data accuracy and reliability are crucial.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time at peak temperature ensures proper soldering and reliability of the connections, reducing the risk of electrical failures.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure soldering, ensuring strong and reliable connections that can withstand thermal stress.

Length: 3 mm

Compact length allows for a space-efficient design, making it suitable for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Maximum Receive Delay: 0.6 ns

Low receive delay ensures fast signal reception, contributing to efficient data transmission and system performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and offers improved reliability and soldering quality, ensuring a sustainable and robust product.

Input Characteristics: DIFFERENTIAL

Differential input characteristics provide noise rejection and signal integrity, ensuring accurate data transmission over long distances or in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage allows for consistent and reliable performance, making it a suitable choice for critical applications where voltage stability is essential.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact layout, enabling efficient use of board space and offering flexibility in system design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage, ensuring product quality and reliability.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates communication between different systems or components, offering compatibility and interoperability for seamless data exchange.

Technical Specifications

Line Drivers & Receivers DS10BR150TSDX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.6 ns

Width:

3 mm

Trade Compliance

DS10BR150TSDX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20