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DS10BR150TSDX

Texas Instruments

DS10BR150TSDX by Texas Instruments

DS10BR150TSDX by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at -40 to 85 °C. It offers differential output, 0.6 ns max transmit/receive delay, and supports 3.3V nominal voltage. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,641 parts In-Stock

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Digiode

USA . 4,152 parts In-Stock

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Anansix

USA . 2,648 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

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$6.702

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407

$6.702

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Parana Technologies

USA . 1,563 parts In-Stock

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$11.100

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$11.558

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1,563

$11.100

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$11.558

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ChromeModa Solutions

Germany . 5,850 parts In-Stock

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$12.472

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$10.227

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5,850

$12.472

$10.227

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

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$12.472

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$11.848

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$11.225

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1,872

$12.472

$11.848

$11.225

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One Stop Electronics

USA . 536 parts In-Stock

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$20.500

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Corphita

USA . 3,852 parts In-Stock

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DigiPath Technology Company

USA . 1,630 parts In-Stock

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$11.245

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$11.245

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Native Components

USA . 553 parts In-Stock

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Northwest PG Solutions

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Overview

Enhance your signal transmission with the DS10BR150TSDX by Texas Instruments. Designed with precision and quality in mind, this line driver/receiver offers reliable performance for a wide range of applications. With a maximum supply voltage of 3.6V and a differential output, this product ensures seamless communication in industrial environments. Its compact square package shape and surface mount capability make installation a breeze. Trust Texas Instruments to deliver cutting-edge technology that brings value and efficiency to your projects. Elevate your system performance with the DS10BR150TSDX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Maximum Transmit Delay: 0.6 ns

Low transmit delay of 0.6 ns ensures fast and efficient data transmission.

No. of Terminals: 8

8 terminals provide ample connectivity options for various interfaces and systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps to optimize thermal performance and space utilization.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures efficient operation even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable operation in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides stability and reliability in connecting to external circuits.

Maximum Seated Height: 0.8 mm

Low maximum seated height of 0.8mm allows for compact and space-efficient designs.

Width: 3 mm

Narrow width of 3mm enables space-saving installation on circuit boards.

Differential Output: YES

Differential output helps to reduce noise and interference in signal transmission, ensuring high-quality data transmission.

Length: 3 mm

Short length of 3mm helps in compact placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial settings.

Maximum Receive Delay: 0.6 ns

Low receive delay of 0.6 ns ensures fast processing of incoming data signals.

Terminal Form: NO LEAD

No lead terminal form provides a more secure and reliable connection.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help in minimizing noise and interference for efficient signal processing.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and efficient operation for the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate sensitivity to moisture, suitable for typical manufacturing and storage conditions.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type provides efficient communication between different systems and components.

Technical Specifications

Line Drivers & Receivers DS10BR150TSDX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N8

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

.6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.6 ns

Width:

3 mm

Trade Compliance

DS10BR150TSDX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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