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DS10BR150TSD

Texas Instruments

DS10BR150TSD by Texas Instruments

DS10BR150TSD by Texas Instruments is a Line Transceiver with Differential Output, suitable for industrial applications. It operates at 3.3V with a max supply voltage of 3.6V and has a small outline package style. With a max transmit delay of 0.6ns, it offers high-speed data transmission capabilities in compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,930 parts In-Stock

1+ parts

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4,930

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Anansix

USA . 1,934 parts In-Stock

1+ parts

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1,934

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Digiode

USA . 419 parts In-Stock

1+ parts

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419

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,222 parts In-Stock

1+ parts

$12.161

100+ parts

-

1k+ parts

$12.574

10k+ parts

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2,222

$12.161

-

$12.574

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$13.664

100+ parts

$12.981

1k+ parts

$12.298

10k+ parts

-

2,068

$13.664

$12.981

$12.298

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ChromeModa Solutions

Germany . 1,610 parts In-Stock

1+ parts

$13.664

100+ parts

$11.204

1k+ parts

-

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1,610

$13.664

$11.204

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$16.211

100+ parts

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597

$16.211

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Native Components

USA . 915 parts In-Stock

1+ parts

$23.009

100+ parts

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915

$23.009

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Northwest PG Solutions

USA . 2,369 parts In-Stock

1+ parts

$25.310

100+ parts

$22.779

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2,369

$25.310

$22.779

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One Stop Electronics

USA . 936 parts In-Stock

1+ parts

$45.500

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936

$45.500

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Lixinc

USA . 9,403 parts In-Stock

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9,403

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 777 parts In-Stock

1+ parts

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100+ parts

$12.319

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777

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$12.319

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Corphita

USA . 763 parts In-Stock

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763

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Kepictronics

USA . 186 parts In-Stock

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186

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Overview

Enhance your communication systems with the DS10BR150TSD by Texas Instruments. As a leader in the industry, Texas Instruments delivers quality products that meet the highest standards. The DS10BR150TSD, belonging to the Line Drivers & Receivers category, offers unparalleled value and benefits. With its surface mount design, small outline package style, and differential output, this product is perfect for a wide range of applications. Experience fast transmit and receive delays, along with reliable performance in industrial environments. Upgrade your systems today with the DS10BR150TSD from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in various applications.

Package Shape: SQUARE

Provides a compact and uniform form factor, making it suitable for applications where space is limited.

Maximum Transmit Delay: 0.6 ns

Enables fast signal transmission, ideal for applications requiring minimal delay.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components or systems.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a combination of compactness, heat dissipation capability, and low profile design for efficient use in various setups.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, conserving power while still maintaining functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial or harsh environments.

Minimum Operating Temperature: -40 °C

Can operate in cold conditions, ensuring reliability in diverse environments.

Terminal Finish: TIN LEAD

Provides a reliable and durable finish for the terminals, ensuring long-term connectivity.

Terminal Position: DUAL

Allows for versatile connection options, enhancing compatibility with different setups.

Maximum Seated Height: 0.8 mm

Low profile design enables installation in compact spaces, reducing overall system height.

Width: 3 mm

Compact width facilitates placement in tight spaces, optimizing board layout.

Differential Output: YES

Supports differential signaling for improved noise immunity and signal integrity in communication.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for a specified duration of reflow process, ensuring proper soldering of the component.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring component durability.

Length: 3 mm

Compact length complements other dimensions, contributing to a compact overall footprint.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, suitable for demanding applications.

Maximum Receive Delay: 0.6 ns

Ensures fast reception of signals, maintaining efficient communication.

Terminal Form: NO LEAD

Improves solder joint reliability and simplifies manufacturing processes with lead-free terminals.

Input Characteristics: DIFFERENTIAL

Supports differential input signals for noise reduction and improved signal quality, ideal for high-speed data transmission.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, ensuring compatibility with common power sources.

Terminal Pitch: 0.5 mm

Close terminal spacing allows for compact design and efficient signal routing on the board.

Interface IC Type: LINE TRANSCEIVER

Specific IC type designed for line transmission, facilitating communication between different parts of a system.

Technical Specifications

Line Drivers & Receivers DS10BR150TSD attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

.6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

.6 ns

Width:

3 mm

Trade Compliance

DS10BR150TSD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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