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MC10E431FNR2G

Onsemi

MC10E431FNR2G by Onsemi

MC10E431FNR2G by Onsemi is a ECL technology chip carrier with 3 functions, 0.85 ns propagation delay, and 1100 MHz fmax. It is used in latches & flip-flops for high-speed applications requiring positive edge trigger and complementary output polarity.

Median Price

$9.510

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.650

10k+ parts

-

5,915

-

-

$8.650

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Rochester

USA . 5,415 parts In-Stock

1+ parts

-

100+ parts

$9.510

1k+ parts

$8.510

10k+ parts

$8.010

5,415

-

$9.510

$8.510

$8.010

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$11.887

1k+ parts

$10.637

10k+ parts

-

2,000

-

$11.887

$10.637

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,828 parts In-Stock

1+ parts

$10.070

100+ parts

-

1k+ parts

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1,828

$10.070

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-

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Vyrian

USA . 8,701 parts In-Stock

1+ parts

-

100+ parts

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8,701

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 335 parts In-Stock

1+ parts

$8.650

100+ parts

-

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335

$8.650

-

-

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Corphita

USA . 2,100 parts In-Stock

1+ parts

$9.540

100+ parts

-

1k+ parts

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10k+ parts

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2,100

$9.540

-

-

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Component Stockers USA

USA . 4,649 parts In-Stock

1+ parts

$10.800

100+ parts

$10.150

1k+ parts

$9.180

10k+ parts

-

4,649

$10.800

$10.150

$9.180

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AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$16.250

100+ parts

-

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10k+ parts

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674

$16.250

-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,890 parts In-Stock

1+ parts

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9,890

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SupplyDigital Components

Austria . 6,149 parts In-Stock

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6,149

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

$8.650

1k+ parts

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5,000

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$8.650

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Kulean Microsystems

USA . 3,208 parts In-Stock

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3,208

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Problanco Electronics

Mexico . 2,262 parts In-Stock

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2,262

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Microchip USA

USA . 1,802 parts In-Stock

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1,802

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TANS Electronics

Latvia . 1,318 parts In-Stock

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1,318

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UHIMA Technologies

Türkiye . 368 parts In-Stock

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368

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Overview

Elevate your electronic designs with the MC10E431FNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This versatile latch & flip-flop component offers lightning-fast propagation delay and is perfect for a wide range of applications. With a nominal supply voltage of 5V and complementary output polarity, this chip carrier package is a game-changer for your projects. Experience the value and benefits that the MC10E431FNR2G brings to the table. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components of the latch/flip-flop.

Propagation Delay At Nominal Supply: 0.85 ns

Fast propagation delay ensures quick response time, making the latch/flip-flop suitable for high-speed applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and making installation convenient.

No. of Functions: 3

Versatile latch/flip-flop with multiple functions, providing flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply requirement for easy integration into existing systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the latch/flip-flop to be used in varying environmental conditions.

Output Characteristics: OPEN-EMITTER

Specific output characteristic for tailored applications that require open-emitter configurations.

Minimum Operating Temperature: 0 °C

Operational even in low-temperature environments, ensuring consistent performance.

Minimum Supply Voltage (Vsup): 4.2 V

Low minimum supply voltage requirement for efficient power consumption.

Maximum Power Supply Current (ICC): 132 mA

Low power supply current consumption for energy-efficient operation.

Technical Specifications

Latches & Flip-Flops MC10E431FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

132 mA

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.85 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC10E431FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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