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MC100LVEP16MNR4

Onsemi

MC100LVEP16MNR4 by Onsemi

MC100LVEP16MNR4 by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 85 °C. It has a max supply voltage of 3.8 V and transmit delay of 0.32 ns. Ideal for industrial applications requiring differential outputs in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 59,000 parts In-Stock

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Vyrian

USA . 4,310 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 411 parts In-Stock

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$12.140

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Component Stockers USA

USA . 332 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 8,209 parts In-Stock

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Problanco Electronics

Mexico . 6,777 parts In-Stock

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SupplyDigital Components

Austria . 5,287 parts In-Stock

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TANS Electronics

Latvia . 3,773 parts In-Stock

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UHIMA Technologies

Türkiye . 636 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

South Africa . 171 parts In-Stock

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Overview

Experience unparalleled performance with the MC100LVEP16MNR4 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality line drivers & receivers that are perfect for various applications. This product offers customers exceptional value with its fast transmit delay, differential output, and wide operating temperature range. Say goodbye to transmission delays and hello to seamless communication with the MC100LVEP16MNR4. Trust Onsemi to provide you with reliable solutions for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for installation and integration into various electronic systems.

Maximum Supply Voltage: 3.8 V

With a high maximum supply voltage, this product can handle higher power requirements and provide reliable performance in diverse applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy placement on circuit boards, making it ideal for compact electronic designs.

Maximum Transmit Delay: 0.32 ns

The low maximum transmit delay ensures fast signal transmission, reducing latency and improving overall system responsiveness.

No. of Terminals: 8

Having multiple terminals provides flexibility in connecting with other components, enabling greater versatility in system configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and compact size, making it suitable for applications where space and thermal management are critical.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and helps optimize power consumption in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions and maintain stable performance in challenging thermal environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions, making it suitable for a variety of industrial applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections and long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances signal integrity and allows for more efficient signal routing within the system, improving overall performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact overall profile, enabling the product to be used in space-constrained applications.

Width: 2 mm

The narrow width of the product makes it suitable for applications where space is limited, allowing for easy integration into tight layouts.

Differential Output: YES

Differential output helps to reduce noise and interference, improving signal quality and enhancing the reliability of data transmission.

Length: 2 mm

The short length of the product contributes to its compact design, making it suitable for use in small electronic devices or densely populated circuit boards.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate effectively in a wide range of temperatures, making it suitable for industrial environments.

Maximum Receive Delay: 0 ns

The zero maximum receive delay ensures fast reception of signals, reducing lag and enhancing the overall speed and responsiveness of the system.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and reduces the risk of solder joint failures, improving the reliability and longevity of the product.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help to reject common-mode noise and interference, improving signal integrity and enhancing the overall performance of the product.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a stable operating voltage for the product, ensuring consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of board space, making it suitable for compact electronic designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication over a single line, simplifying system design and enhancing communication efficiency.

Technical Specifications

Line Drivers & Receivers MC100LVEP16MNR4 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375 V TO -3.8 V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.32 ns

Width:

2 mm

Trade Compliance

MC100LVEP16MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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