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MC100LVEL29DWG

Onsemi

MC100LVEL29DWG by Onsemi

MC100LVEL29DWG by Onsemi is a dual-function latch with 0.7ns propagation delay, operating at -40 to 85°C. Ideal for industrial applications, it has a max fmax of 1100MHz and operates on a nominal voltage of 3.3V.

Median Price

$6.357

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$5.207

100+ parts

-

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-

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1

$5.207

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-

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Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$9.030

100+ parts

$6.310

1k+ parts

$5.900

10k+ parts

$5.770

31

$9.030

$6.310

$5.900

$5.770

DigiKey

USA . 1,037 parts In-Stock

1+ parts

$10.080

100+ parts

$7.105

1k+ parts

$6.227

10k+ parts

$6.092

1,037

$10.080

$7.105

$6.227

$6.092

Flip Electronics (Authorized)

USA . 4,218 parts In-Stock

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Verical

USA . 1,786 parts In-Stock

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$6.357

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1,786

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$6.357

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Rochester

USA . 475 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

$4.970

10k+ parts

$4.680

475

-

$5.560

$4.970

$4.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,381 parts In-Stock

1+ parts

$4.947

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1,381

$4.947

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Vyrian

USA . 5,414 parts In-Stock

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5,414

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Flip Electronics

USA . 1,786 parts In-Stock

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1,786

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Component Sense

UK . 334 parts In-Stock

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334

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ComSIT Distribution GmbH

Germany . 76 parts In-Stock

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Speed Components Ltd

Israel . 25 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 324 parts In-Stock

1+ parts

$4.686

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324

$4.686

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Corohmni

South Africa . 313 parts In-Stock

1+ parts

$5.207

100+ parts

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313

$5.207

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Component Stockers USA

USA . 1,405 parts In-Stock

1+ parts

$5.240

100+ parts

$6.300

1k+ parts

$5.690

10k+ parts

-

1,405

$5.240

$6.300

$5.690

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$14.190

100+ parts

$12.913

1k+ parts

$11.636

10k+ parts

-

600

$14.190

$12.913

$11.636

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Microchip USA

USA . 1,128 parts In-Stock

1+ parts

$31.440

100+ parts

$30.990

1k+ parts

$30.770

10k+ parts

$30.550

1,128

$31.440

$30.990

$30.770

$30.550

Kulean Microsystems

USA . 6,282 parts In-Stock

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SupplyDigital Components

Austria . 4,598 parts In-Stock

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Problanco Electronics

Mexico . 3,041 parts In-Stock

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TANS Electronics

Latvia . 1,854 parts In-Stock

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Perfect Parts

USA . 1,142 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 340 parts In-Stock

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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Kepictronics

USA . 58 parts In-Stock

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Assy Fe

Spain . 8 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the MC100LVEL29DWG Latches & Flip-Flops. Designed for industrial-grade applications, this product offers fast propagation delay, high operating temperature, and a wide supply voltage range. With its compact package style and surface mount capability, it provides convenience and versatility for your design needs. Trust Onsemi to deliver cutting-edge technology and superior performance that exceeds expectations. Elevate your projects with the MC100LVEL29DWG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the latch, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and integration onto PCBs, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions allows for versatile use and customization based on specific requirements.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperature environments, expanding the range of potential use cases.

Maximum Seated Height: 2.65 mm

Low profile design saves space and allows for compact installations in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly process, leading to better overall product quality.

Minimum fmax: 1100 MHz

High operating frequency capability allows for fast and efficient data processing.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring reliable performance in humid or damp conditions.

Technical Specifications

Latches & Flip-Flops MC100LVEL29DWG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100LVEL29DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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