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MC100EP16VCDG

Onsemi

MC100EP16VCDG by Onsemi

MC100EP16VCDG by Onsemi is a Line Driver & Receiver with 8 terminals, ECL technology, and differential output. It operates at -40 to 85 °C with a supply voltage range of 3-5.5 V. Ideal for industrial applications requiring fast signal transmission with minimal delay.

Median Price

$4.675

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 88 parts In-Stock

1+ parts

$7.210

100+ parts

$6.212

1k+ parts

$6.212

10k+ parts

$6.212

88

$7.210

$6.212

$6.212

$6.212

Rochester

USA . 67,795 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

67,795

-

$3.740

$3.350

$3.150

Verical

USA . 23,814 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

23,814

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,507 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$3.962

-

-

-

Vyrian

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,642 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

$3.753

-

-

-

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$4.120

-

-

-

Microchip USA

USA . 370 parts In-Stock

1+ parts

$19.992

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$19.992

-

-

-

Continental Prestige Electronics

USA . 67,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67,795

-

-

-

-

Problanco Electronics

Mexico . 2,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,456

-

-

-

-

TANS Electronics

Latvia . 1,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,941

-

-

-

-

Kulean Microsystems

USA . 1,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,501

-

-

-

-

UHIMA Technologies

Türkiye . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

854

-

-

-

-

Perfect Parts

USA . 62 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62

-

-

-

-

SupplyDigital Components

Austria . 53 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53

-

-

-

-

Overview

Enhance your electronic designs with the MC100EP16VCDG by Onsemi. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless communication and fast transmission speeds. Experience the value of efficient performance and seamless connectivity with the MC100EP16VCDG. Elevate your projects with Onsemi's cutting-edge technology and unlock a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and compact integration into circuit boards, saving space and simplifying installation.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement and alignment on the circuit board, enhancing the overall efficiency of the assembly process.

Maximum Transmit Delay: 0.4 ns

The minimal transmit delay ensures fast and efficient data transmission, crucial for high-speed communication applications.

Power Supplies (V): -4.5

The negative power supply option allows for versatile power configurations, enabling the product to adapt to a variety of system requirements.

No. of Terminals: 8

Having 8 terminals provides ample connection points for interfacing with other components, improving the product's compatibility and flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices and applications with limited real estate.

Maximum High Level Input Current: 0.00015 Amp

The low high level input current requirement minimizes power consumption and heat generation, contributing to the overall efficiency and reliability of the product.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, offering operational flexibility and ease of integration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the product to withstand elevated environmental conditions, making it suitable for industrial or outdoor use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance enables the product to function reliably in cold environments, enhancing its versatility and usability.

Terminal Finish: TIN

The use of tin as a terminal finish provides good electrical conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: DUAL

Having dual terminal positions offers additional flexibility in mounting and connection options, making the product easier to integrate into diverse systems.

Maximum Seated Height: 1.75 mm

The low seated height minimizes the overall profile of the product, enabling it to fit into slim or compact devices without adding bulk.

Width: 3.9 mm

The narrow width of the product allows for efficient use of space on the circuit board, facilitating compact and streamlined electronic designs.

Differential Output: YES

The differential output feature enhances noise immunity and signal integrity, making the product suitable for high-precision data transmission applications.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time allowance at peak reflow temperature ensures reliable soldering and assembly processes, preventing potential damage or defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering connections, ensuring structural integrity and longevity of the product.

Length: 4.9 mm

The compact length of the product complements its narrow width, enabling a space-efficient footprint on the circuit board for optimized layout designs.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance makes the product suitable for harsh operating environments, ensuring consistent performance in challenging conditions.

Maximum Receive Delay: 0.4 ns

The minimal receive delay complements the fast transmit delay, facilitating synchronized and efficient data exchange between connected devices.

Technology: ECL

The ECL technology used in the product offers fast signal processing speeds and low power consumption, making it suitable for high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly, ensuring secure and reliable connections for long-term use.

Maximum Supply Current: 38 mA

The low maximum supply current requirement contributes to energy efficiency and minimal power consumption, making the product cost-effective and environmentally friendly.

Input Characteristics: DIFFERENTIAL

The differential input characteristics enhance noise rejection and signal integrity, enabling the product to achieve reliable data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent and reliable operation of the product, supporting dependable performance in various electrical systems.

Nominal Negative Supply Voltage: -4.5 V

The stable nominal negative supply voltage complements the positive supply voltage, enabling balanced power delivery for optimal performance and functionality.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy connection and compatibility with common socket and connector configurations, facilitating hassle-free integration.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type supports bidirectional data communication between multiple devices, enabling seamless connectivity and data exchange in complex systems.

Technical Specifications

Line Drivers & Receivers MC100EP16VCDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.4 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.4 ns

Width:

3.9 mm

Trade Compliance

MC100EP16VCDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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