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MC100EP16VADG

Onsemi

MC100EP16VADG by Onsemi

MC100EP16VADG by Onsemi is a Line Driver & Receiver with ECL technology. It operates at 3-5.5 V, has 0.34 ns transmit/receive delay, and supports differential input. Ideal for industrial applications requiring high-speed data transmission in compact designs.

Median Price

$8.411

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 102 parts In-Stock

1+ parts

$9.960

100+ parts

$6.760

1k+ parts

$5.700

10k+ parts

$5.650

102

$9.960

$6.760

$5.700

$5.650

DigiKey

USA . 78 parts In-Stock

1+ parts

$9.960

100+ parts

$6.625

1k+ parts

$6.123

10k+ parts

$6.002

78

$9.960

$6.625

$6.123

$6.002

Flip Electronics (Authorized)

USA . 19,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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19,306

-

-

-

-

Rochester

USA . 12,598 parts In-Stock

1+ parts

-

100+ parts

$5.490

1k+ parts

$4.910

10k+ parts

$4.620

12,598

-

$5.490

$4.910

$4.620

Verical

USA . 6,958 parts In-Stock

1+ parts

-

100+ parts

$6.862

1k+ parts

$6.138

10k+ parts

$5.775

6,958

-

$6.862

$6.138

$5.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 615 parts In-Stock

1+ parts

$5.795

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$5.795

-

-

-

Flip Electronics

USA . 19,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,306

-

-

-

-

Vyrian

USA . 3,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,715

-

-

-

-

ECAB

Sweden . 30 parts In-Stock

1+ parts

-

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-

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30

-

-

-

-

Bristol Electronics

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,795 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

$5.490

-

-

-

Corohmni

South Africa . 104 parts In-Stock

1+ parts

$6.100

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$6.100

-

-

-

Microchip USA

USA . 2,251 parts In-Stock

1+ parts

$31.000

100+ parts

$30.550

1k+ parts

$30.330

10k+ parts

$30.110

2,251

$31.000

$30.550

$30.330

$30.110

Problanco Electronics

Mexico . 8,095 parts In-Stock

1+ parts

-

100+ parts

-

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8,095

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-

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SupplyDigital Components

Austria . 7,906 parts In-Stock

1+ parts

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7,906

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TANS Electronics

Latvia . 2,889 parts In-Stock

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2,889

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Kulean Microsystems

USA . 535 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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535

-

-

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UHIMA Technologies

Türkiye . 207 parts In-Stock

1+ parts

-

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207

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Perfect Parts

USA . 205 parts In-Stock

1+ parts

-

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205

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-

-

Overview

Enhance your communication systems with the MC100EP16VADG by Onsemi, a top-notch line driver & receiver that guarantees reliable performance and seamless signal transmission. With a focus on quality and precision, Onsemi delivers cutting-edge technology in a compact package, perfect for a wide range of applications. From industrial settings to telecommunications, this product offers unmatched value with its high-speed data transmission capabilities and robust design. Upgrade your systems today with the MC100EP16VADG and experience the difference in efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it versatile for a wide range of applications.

Maximum Transmit Delay: 0.34 ns

Ensures fast signal transmission, reducing latency in data communication.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, suitable for industrial applications.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Nominal Supply Voltage: 3.3 V

Efficiently operates at a standard voltage level, ensuring compatibility with various systems.

Technical Specifications

Line Drivers & Receivers MC100EP16VADG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.34 ns

Width:

3.9 mm

Trade Compliance

MC100EP16VADG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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