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LV8062FA-AH

Onsemi

LV8062FA-AH by Onsemi

LV8062FA-AH by Onsemi is a Motion Control IC with 5V supply voltage, 0.7A output current, and BICMOS technology. Ideal for BRUSH DC MOTOR CONTROL applications due to its small outline package, dual terminals, and 3mm length.

Median Price

$0.646

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,393 parts In-Stock

1+ parts

-

100+ parts

$0.634

1k+ parts

$0.526

10k+ parts

$0.469

8,393

-

$0.634

$0.526

$0.469

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.658

10k+ parts

-

4,000

-

-

$0.658

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,238 parts In-Stock

1+ parts

$0.494

100+ parts

-

1k+ parts

-

10k+ parts

-

2,238

$0.494

-

-

-

Vyrian

USA . 4,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,726

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,355 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

$0.468

-

-

-

Corohmni

South Africa . 279 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

279

$0.520

-

-

-

Component Stockers USA

USA . 10,225 parts In-Stock

1+ parts

$0.530

100+ parts

$0.500

1k+ parts

$0.450

10k+ parts

-

10,225

$0.530

$0.500

$0.450

-

AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$15.110

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$15.110

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,434

-

-

-

-

SupplyDigital Components

Austria . 7,526 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,526

-

-

-

-

TANS Electronics

Latvia . 6,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,960

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-

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Microchip USA

USA . 5,120 parts In-Stock

1+ parts

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100+ parts

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5,120

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Problanco Electronics

Mexico . 1,999 parts In-Stock

1+ parts

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100+ parts

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1,999

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-

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Kulean Microsystems

USA . 579 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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579

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UHIMA Technologies

Türkiye . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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450

-

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-

Overview

Elevate your motion control systems with the LV8062FA-AH by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability. Designed for brush DC motor controllers, this IC offers precise control and efficiency like never before. With a compact package style and a wide operating temperature range, this product is perfect for a variety of applications. Experience the value and benefits of seamless motion control with the LV8062FA-AH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of cost and durability, making the product cost-effective and reliable.

Surface Mount: YES

Ease of installation and compatibility with modern manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

Common voltage that is easily available and compatible with many systems.

Maximum Seated Height: 1.03 mm

Low profile design for space-constrained applications.

Maximum Output Current: 0.7 A

Capable of driving motors with moderate power requirements, suitable for various applications.

Technology: BICMOS

Combines the advantages of Bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Motion Control ICs LV8062FA-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

OUTPUT CURRENT IN LOCK-DETECTION MODE IS 1A, SEATED HGT-NOM

Other IC type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.03 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LV8062FA-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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