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LV8012T-MPB-E

Onsemi

LV8012T-MPB-E by Onsemi

LV8012T-MPB-E by Onsemi is a Motion Control IC with 24 terminals, operating at 5V. It features a small outline package, suitable for brush DC motor control applications. With a max output current of 1.4A and BICMOS technology, it ensures efficient performance in commercial extended temperature environments.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,844 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

1,844

-

$1.320

$1.180

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 449 parts In-Stock

1+ parts

$1.378

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$1.378

-

-

-

Vyrian

USA . 4,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,162

-

-

-

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DigiKey Marketplace

USA . 1,844 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

-

10k+ parts

-

1,844

-

$1.510

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,624 parts In-Stock

1+ parts

$1.305

100+ parts

-

1k+ parts

-

10k+ parts

-

1,624

$1.305

-

-

-

Corohmni

South Africa . 463 parts In-Stock

1+ parts

$1.450

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$1.450

-

-

-

Component Stockers USA

USA . 4,902 parts In-Stock

1+ parts

$1.470

100+ parts

$1.380

1k+ parts

$1.250

10k+ parts

-

4,902

$1.470

$1.380

$1.250

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.554

100+ parts

$5.964

1k+ parts

$5.374

10k+ parts

-

2,000

$6.554

$5.964

$5.374

-

AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$13.940

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$13.940

-

-

-

SupplyDigital Components

Austria . 7,126 parts In-Stock

1+ parts

-

100+ parts

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7,126

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-

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TANS Electronics

Latvia . 6,548 parts In-Stock

1+ parts

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6,548

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-

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Problanco Electronics

Mexico . 3,573 parts In-Stock

1+ parts

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3,573

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-

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Kulean Microsystems

USA . 3,392 parts In-Stock

1+ parts

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100+ parts

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3,392

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UHIMA Technologies

Türkiye . 529 parts In-Stock

1+ parts

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529

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Microchip USA

USA . 306 parts In-Stock

1+ parts

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306

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Overview

Unleash the power of motion control with the LV8012T-MPB-E by Onsemi. Crafted with precision and expertise, this motion control IC offers unparalleled quality and reliability for a wide range of applications. From robotics to automotive systems, this product ensures smooth and precise motion control, taking your projects to new heights. Experience the value and benefits of superior performance with Onsemi's innovative technology, setting a new standard in motion control ICs. Elevate your designs with the LV8012T-MPB-E and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the internal components of the IC.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V provides stable power to the IC for reliable performance.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and functionality in different systems.

Maximum Output Current: 1.4 A

The high maximum output current of 1.4A enables the IC to drive motors effectively.

Technology: BICMOS

The BICMOS technology offers a good balance between the advantages of both bipolar and CMOS technologies, providing efficient operation.

Technical Specifications

Motion Control ICs LV8012T-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 2 TO 7V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

1.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LV8012T-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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