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LV8013T

Onsemi

LV8013T by Onsemi

LV8013T by Onsemi is a Motion Control IC with 24 terminals, operating at -20 to 75 °C. It supports 5V nominal voltage and offers power supplies of 5V and 12V. Ideal for BRUSH DC MOTOR CONTROL applications due to its BICMOS technology and max output current of 3.8A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,972 parts In-Stock

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Vyrian

USA . 894 parts In-Stock

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894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,779 parts In-Stock

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6,779

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Kulean Microsystems

USA . 4,263 parts In-Stock

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4,263

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SupplyDigital Components

Austria . 3,420 parts In-Stock

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3,420

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TANS Electronics

Latvia . 1,569 parts In-Stock

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Corphita

USA . 452 parts In-Stock

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452

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Corohmni

South Africa . 265 parts In-Stock

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265

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Overview

Experience next-level motion control with the Onsemi LV8013T. Crafted with precision and expertise, this Motion Control IC offers unparalleled quality and reliability for a wide range of applications. From robotics to automation, this IC provides seamless power supplies and efficient control with its innovative technology. Say goodbye to limitations and hello to limitless possibilities with the LV8013T by Onsemi. Elevate your projects today with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body material is lightweight and durable, making it suitable for various applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V ensures compatibility with a wide range of power sources, making it versatile and easy to integrate into different systems.

No. of Terminals: 24

With 24 terminals, this motion control IC offers ample connectivity options for interfacing with other components and peripherals, enhancing its flexibility and functionality.

Maximum Output Current: 3.8 A

The high maximum output current of 3.8A allows the IC to drive larger motors and handle more demanding applications, making it a powerful and reliable choice for motion control.

Technical Specifications

Motion Control ICs LV8013T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 2 TO 15V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

3.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LV8013T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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