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LB1867M-MPB-E

Onsemi

LB1867M-MPB-E by Onsemi

LB1867M-MPB-E by Onsemi is a Motion Control IC with 12/24V power supplies, 14 terminals, and operating temperatures from -30 to 80 °C. It features a small outline package style for surface mount applications. Ideal for commercial extended temperature grade motion control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,386 parts In-Stock

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Digiode

USA . 396 parts In-Stock

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396

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AZTECH Wire

Italy . 1,052 parts In-Stock

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$18.420

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TANS Electronics

Latvia . 5,406 parts In-Stock

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Kulean Microsystems

USA . 1,895 parts In-Stock

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SupplyDigital Components

Austria . 1,501 parts In-Stock

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Corphita

USA . 1,418 parts In-Stock

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Problanco Electronics

Mexico . 882 parts In-Stock

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UHIMA Technologies

Türkiye . 343 parts In-Stock

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Corohmni

South Africa . 301 parts In-Stock

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Microchip USA

USA . 116 parts In-Stock

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Overview

Enhance your motion control applications with the LB1867M-MPB-E by Onsemi. Crafted with precision and reliability, this motion control IC offers seamless integration and unparalleled performance. From robotics to automation, this product guarantees optimal functionality and efficiency. Experience the value of superior quality and cutting-edge technology with Onsemi's LB1867M-MPB-E, bringing innovation and excellence to every project. Unlock limitless possibilities and elevate your creations with this advanced motion control IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability makes it easier to integrate the IC into circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 12/24

Support for both 12V and 24V power supplies gives flexibility in application compatibility, allowing the IC to be used in a wider range of devices.

No. of Terminals: 14

More terminals allow for increased connectivity options, enabling versatile usage scenarios for the IC.

Maximum Operating Temperature: 80 °C

High maximum operating temperature tolerance ensures stability and performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -30 °C

Wide temperature range allows for reliable operation even in cold conditions, making the IC suitable for diverse applications.

Terminal Finish: TIN BISMUTH

Tin Bismuth finish provides corrosion resistance and better solderability, enhancing the overall reliability of the IC.

Technology: BIPOLAR

Bipolar technology offers superior performance and precision control, making the IC ideal for motion control applications requiring high accuracy.

Technical Specifications

Motion Control ICs LB1867M-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12/24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LB1867M-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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