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LB1830M-TLM-E

Onsemi

LB1830M-TLM-E by Onsemi

LB1830M-TLM-E by Onsemi is a Motion Control IC with 10 terminals, operating at -20 to 80 °C. It has a supply voltage of 6V and max current of 8mA. Ideal for applications requiring small outline, shrink pitch package style in commercial extended temperature grade.

Median Price

$1.245

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

1,000

-

$1.200

$0.996

$0.888

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

-

1,000

-

-

$1.500

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.245

10k+ parts

$1.110

1,000

-

-

$1.245

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 57 parts In-Stock

1+ parts

$0.937

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$0.937

-

-

-

Vyrian

USA . 11,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,254

-

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 213 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$0.870

-

-

-

Corphita

USA . 1,491 parts In-Stock

1+ parts

$0.887

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$0.887

-

-

-

SupplyDigital Components

Austria . 6,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,669

-

-

-

-

Kulean Microsystems

USA . 3,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,839

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

TANS Electronics

Latvia . 1,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,579

-

-

-

-

Problanco Electronics

Mexico . 1,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,390

-

-

-

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UHIMA Technologies

Türkiye . 409 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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409

-

-

-

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Microchip USA

USA . 219 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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219

-

-

-

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Continental Prestige Electronics

USA . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.842

10k+ parts

-

89

-

-

$0.842

-

Overview

Unleash the power of precision with the LB1830M-TLM-E by Onsemi! Crafted by a trusted industry leader, this motion control IC is designed to deliver unparalleled performance and reliability. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. Experience seamless operation and superior quality with the LB1830M-TLM-E - your ultimate solution for motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good protection and durability for the Motion Control ICs, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the ICs onto circuit boards, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 6 V

The 6V supply voltage is suitable for a wide range of applications, providing optimal performance and efficiency for the Motion Control ICs.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, these ICs can withstand high temperatures, making them ideal for industrial or automotive applications.

Technology: BIPOLAR

The bipolar technology used in these ICs ensures reliable and precise control over motion, making them a suitable choice for motion control applications.

Technical Specifications

Motion Control ICs LB1830M-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

10

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

8 mA

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1830M-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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