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LB11948T-TLM-E

Onsemi

LB11948T-TLM-E by Onsemi

LB11948T-TLM-E by Onsemi is a Motion Control IC with 30 terminals, operating voltage of 3-15V. It features a max output current of 0.5A, suitable for Stepper Motor Controllers. The IC has a compact design with small outline and thin profile, making it ideal for applications requiring precise motion control in tight spaces.

Median Price

$0.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 228 parts In-Stock

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$0.259

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Verical

USA . 228 parts In-Stock

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$1.120

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Digiode

USA . 2,404 parts In-Stock

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$0.246

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Vyrian

USA . 4,884 parts In-Stock

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Semi Source

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Corphita

USA . 2,076 parts In-Stock

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$0.233

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Corohmni

South Africa . 87 parts In-Stock

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Component Stockers USA

USA . 532 parts In-Stock

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$1.180

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$1.110

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532

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AZTECH Wire

Italy . 1,169 parts In-Stock

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$13.540

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Perfect Parts

USA . 31,082 parts In-Stock

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TANS Electronics

Latvia . 8,272 parts In-Stock

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Problanco Electronics

Mexico . 6,813 parts In-Stock

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SupplyDigital Components

Austria . 4,831 parts In-Stock

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Futuretech Components

Singapore . 3,500 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 1,024 parts In-Stock

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Kulean Microsystems

USA . 494 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Overview

Enhance your motion control systems with the LB11948T-TLM-E by Onsemi, a top-of-the-line Motion Control IC designed to deliver exceptional performance and reliability. Onsemi is renowned for its high-quality products, and this stepper motor controller is no exception. Perfect for a wide range of applications, this IC offers precise control and seamless operation, ensuring smooth and efficient functionality. Trust Onsemi to provide you with cutting-edge technology that will elevate your projects to the next level. Choose the LB11948T-TLM-E and experience unparalleled value and benefits in motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Operating at 5V ensures compatibility with common power sources and reduces the need for additional voltage regulation.

No. of Terminals: 30

Having 30 terminals allows for a high level of input and output connections, making the IC versatile and adaptable to different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability under demanding conditions.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, the IC can function in cold environments without any issues.

Maximum Output Current: 0.5 A

The maximum output current of 0.5A allows for driving motors or other devices with relatively high power requirements.

Technology: BIPOLAR

Bipolar technology provides precise control and efficient operation for motion control applications.

Technical Specifications

Motion Control ICs LB11948T-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LB11948T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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