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LB11852FV-W-AH

Onsemi

LB11852FV-W-AH by Onsemi

LB11852FV-W-AH by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 5.5-16 V, and max output current of 0.02 A. It is ideal for AC motor control applications due to its small outline package, dual terminal position, and peak reflow temp of 260 °C.

Median Price

$0.713

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,859 parts In-Stock

1+ parts

-

100+ parts

$0.713

1k+ parts

$0.592

10k+ parts

$0.528

1,859

-

$0.713

$0.592

$0.528

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 799 parts In-Stock

1+ parts

$0.846

100+ parts

-

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799

$0.846

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Vyrian

USA . 7,018 parts In-Stock

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7,018

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Distributors (Availability)

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Corphita

USA . 1,688 parts In-Stock

1+ parts

$0.801

100+ parts

-

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1,688

$0.801

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Corohmni

South Africa . 489 parts In-Stock

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$0.890

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489

$0.890

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AZTECH Wire

Italy . 336 parts In-Stock

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$19.680

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336

$19.680

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QUARKTWIN TECHNOLOGY LTD

USA . 27,510 parts In-Stock

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27,510

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Microchip USA

USA . 5,578 parts In-Stock

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5,578

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TANS Electronics

Latvia . 4,433 parts In-Stock

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4,433

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 1,812 parts In-Stock

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1,812

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UHIMA Technologies

Türkiye . 357 parts In-Stock

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357

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Problanco Electronics

Mexico . 220 parts In-Stock

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220

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Kulean Microsystems

USA . 214 parts In-Stock

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214

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Overview

Unlock the power of precise motion control with the LB11852FV-W-AH by Onsemi. Crafted with top-notch quality and expertise, this motion control IC is designed to deliver seamless performance in a variety of applications. Whether you're looking to enhance automation processes or improve motor control efficiency, this product offers unmatched value and benefits. Experience the advantages of Onsemi's innovative technology and elevate your projects to new heights with the LB11852FV-W-AH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides protection and durability to the motion control IC, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage (Vsup): 12 V

The 12V nominal supply voltage ensures compatibility with a wide range of electronic systems and applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with external devices and components in a motion control system.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95 °C ensures reliable performance even in demanding thermal environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows the motion control IC to function effectively in cold conditions.

Maximum Output Current: 0.02 A

The maximum output current of 0.02A indicates the ability of the IC to drive motors or other devices with sufficient power.

Technical Specifications

Motion Control ICs LB11852FV-W-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPEARSTES WITH 4.5V TO 5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.02 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11852FV-W-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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