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LB11850VA-W-AH

Onsemi

LB11850VA-W-AH by Onsemi

LB11850VA-W-AH by Onsemi is a Motion Control IC with 24 terminals, operating voltage range of 5.5V to 12V, and max output current of 0.02A. Ideal for AC motor control applications due to its small outline package and temp range from -30 °C to 95°C.

Median Price

$0.846

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 972 parts In-Stock

1+ parts

-

100+ parts

$0.832

1k+ parts

$0.691

10k+ parts

$0.616

972

-

$0.832

$0.691

$0.616

Verical

USA . 972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.861

10k+ parts

$0.768

972

-

-

$0.861

$0.768

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,026 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

-

2,026

$0.647

-

-

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Vyrian

USA . 5,488 parts In-Stock

1+ parts

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5,488

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,406 parts In-Stock

1+ parts

$0.613

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$0.613

-

-

-

Corohmni

South Africa . 162 parts In-Stock

1+ parts

$0.681

100+ parts

-

1k+ parts

-

10k+ parts

-

162

$0.681

-

-

-

AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$18.910

100+ parts

-

1k+ parts

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10k+ parts

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346

$18.910

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,571 parts In-Stock

1+ parts

-

100+ parts

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28,571

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Microchip USA

USA . 4,851 parts In-Stock

1+ parts

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100+ parts

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4,851

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-

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Kulean Microsystems

USA . 4,168 parts In-Stock

1+ parts

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1k+ parts

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4,168

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-

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SupplyDigital Components

Austria . 3,595 parts In-Stock

1+ parts

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100+ parts

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3,595

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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TANS Electronics

Latvia . 1,851 parts In-Stock

1+ parts

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100+ parts

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1,851

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-

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Problanco Electronics

Mexico . 1,494 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,494

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-

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UHIMA Technologies

Türkiye . 597 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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597

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Overview

Experience seamless motion control with the LB11850VA-W-AH by Onsemi. Crafted with precision and expertise, this product offers unparalleled performance in a compact package. Ideal for applications requiring precise motor control, this motion control IC boasts a wide range of features that cater to various needs. From its small outline design to its advanced technology, this product guarantees efficient operation and reliable results. Trust Onsemi for quality products that deliver value and innovation to your projects. Elevate your motion control experience with the LB11850VA-W-AH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability of the product.

Surface Mount: YES

Enables easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 12 V

Works well with standard power sources and is compatible with a wide range of applications.

Number of Terminals: 24

Offers flexibility in connecting to other components and peripherals for versatile functionality.

Maximum Operating Temperature: 95 °C

Can withstand high temperature environments, making it suitable for various industrial applications.

Minimum Operating Temperature: -30 °C

Operates reliably even in low temperature conditions, ensuring performance in different environments.

Technology: BIPOLAR

Provides high power output and efficiency for controlling AC motors effectively.

Maximum Supply Voltage (Vsup): 16 V

Allows for flexibility in power input range while remaining within safe operating limits.

Technical Specifications

Motion Control ICs LB11850VA-W-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.02 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11850VA-W-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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