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LB11822-E

Onsemi

LB11822-E by Onsemi

LB11822-E by Onsemi is a Motion Control IC with 24V supply voltage. It features 28 terminals, operates b/w -20 to 80 °C, and has a max supply current of 30mA. Ideal for applications requiring precise motion control in commercial extended temperature environments.

Median Price

$1.613

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.290

10k+ parts

$1.150

4,680

-

$1.550

$1.290

$1.150

DigiKey

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.940

10k+ parts

-

4,680

-

-

$1.940

-

Verical

USA . 4,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.613

10k+ parts

$1.438

4,600

-

-

$1.613

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 98 parts In-Stock

1+ parts

$1.206

100+ parts

-

1k+ parts

-

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-

98

$1.206

-

-

-

Vyrian

USA . 11,449 parts In-Stock

1+ parts

-

100+ parts

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11,449

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,284 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

4,284

$0.950

-

-

-

Corohmni

South Africa . 467 parts In-Stock

1+ parts

$1.120

100+ parts

-

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-

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-

467

$1.120

-

-

-

Corphita

USA . 2,121 parts In-Stock

1+ parts

$1.143

100+ parts

-

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-

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2,121

$1.143

-

-

-

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$9.300

100+ parts

-

1k+ parts

-

10k+ parts

-

747

$9.300

-

-

-

SupplyDigital Components

Austria . 7,272 parts In-Stock

1+ parts

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7,272

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-

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Kulean Microsystems

USA . 5,971 parts In-Stock

1+ parts

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5,971

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-

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TANS Electronics

Latvia . 5,715 parts In-Stock

1+ parts

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100+ parts

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5,715

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-

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Problanco Electronics

Mexico . 5,109 parts In-Stock

1+ parts

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5,109

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-

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Continental Prestige Electronics

USA . 4,680 parts In-Stock

1+ parts

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100+ parts

$1.080

1k+ parts

-

10k+ parts

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4,680

-

$1.080

-

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Kepictronics

USA . 392 parts In-Stock

1+ parts

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392

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Microchip USA

USA . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 74 parts In-Stock

1+ parts

-

100+ parts

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74

-

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Overview

Enhance your motion control systems with the LB11822-E by Onsemi. Crafted with precision and expertise, this top-tier Motion Control IC offers unparalleled performance and reliability, ensuring seamless operation in a variety of applications. From robotics to industrial automation, this cutting-edge IC delivers exceptional value, efficiency, and precision at every turn. Elevate your projects with the LB11822-E and experience the superior quality and innovation that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24 V ensures compatibility with a wide range of industrial applications.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this product can withstand high temperature environments without compromising performance.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides excellent solderability and ensures reliable electrical connections.

Technology: BIPOLAR

The use of bipolar technology enhances the performance and efficiency of the motion control ICs.

Technical Specifications

Motion Control ICs LB11822-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e6

No. of Terminals:

28

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.5

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LB11822-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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