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J111RL1G

Onsemi

J111RL1G by Onsemi

J111RL1G by Onsemi is a N-CHANNEL FET with 3 terminals and 0.35W power dissipation. Ideal for chopper applications, it operates in depletion mode with max temp of 150 °C. Featuring a max on resistance of 30 ohm, it has a feedback capacitance of 5pF and uses silicon as the transistor element material.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,070 parts In-Stock

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Digiode

USA . 706 parts In-Stock

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AZTECH Wire

Italy . 594 parts In-Stock

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$13.940

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Ampacity Inc.

Singapore . 690 parts In-Stock

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$52.050

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Problanco Electronics

Mexico . 7,832 parts In-Stock

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TANS Electronics

Latvia . 5,879 parts In-Stock

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SupplyDigital Components

Austria . 5,801 parts In-Stock

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Kulean Microsystems

USA . 4,349 parts In-Stock

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Corphita

USA . 1,917 parts In-Stock

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UHIMA Technologies

Türkiye . 669 parts In-Stock

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Corohmni

South Africa . 482 parts In-Stock

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Overview

Enhance your electronic projects with the J111RL1G by Onsemi, a high-quality N-channel small signal field-effect transistor. Manufactured by Onsemi, this FET offers exceptional performance and reliability for applications such as chopper circuits. With a maximum power dissipation of 0.35W and a low drain-source resistance of 30 ohms, this transistor provides excellent value and efficiency for your designs. Upgrade your projects with the superior quality and benefits of the J111RL1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and lower losses compared to P-Channel FETs, making them a more efficient choice.

Configuration: SINGLE

Single configuration FETs are simpler to use and integrate into circuits, making them a popular choice for various applications.

Transistor Application: CHOPPER

Chopper applications require FETs with fast switching capabilities and low on-resistance, which this transistor provides.

Package Shape: ROUND

The round package shape allows for easier handling and installation in various circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals are more robust and provide better mechanical strength, ensuring a secure connection in the circuit.

Operating Mode: DEPLETION MODE

Depletion mode FETs offer better control over the flow of current, making them ideal for applications where precise current regulation is required.

Maximum Power Dissipation: 0.35 W

With a high maximum power dissipation, this transistor can handle higher power levels without overheating, making it reliable for harsh operating conditions.

Package Style: CYLINDRICAL

The cylindrical package style provides a compact design, saving space on the circuit board while maintaining good thermal performance.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high-speed switching capabilities and low gate capacitance, making this transistor suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this transistor to be used in a wide range of temperature conditions without performance degradation.

Transistor Element Material: SILICON

Silicon FETs offer good reliability and performance characteristics, making them a popular choice for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, ensuring a reliable connection in the circuit.

Maximum Drain-Source On Resistance: 30 ohm

With a low on-resistance, this transistor minimizes power losses and improves efficiency in various applications.

Terminal Position: BOTTOM

The bottom terminal position allows for easy mounting on the circuit board and efficient heat dissipation.

Peak Reflow Temperature: 260 C

The high peak reflow temperature makes this transistor suitable for reflow soldering processes, ensuring secure and durable connections.

Maximum Feedback Capacitance: 5 pF

The low feedback capacitance helps to minimize signal distortion and improve overall performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) J111RL1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Maximum Drain-Source On Resistance:

30 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

CHOPPER

Transistor Element Material:

SILICON

Trade Compliance

J111RL1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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