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J110RLRA

Onsemi

J110RLRA by Onsemi

J110RLRA by Onsemi is a N-CHANNEL FET with 3 terminals, operating in DEPLETION MODE. It has a max power dissipation of 0.31W and max drain-source on resistance of 18 ohm. Ideal for SWITCHING applications due to its high feedback capacitance of 15pF and peak reflow temperature of 235°C.

Median Price

$0.291

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,364 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

15,364

-

$0.291

$0.241

$0.215

DigiKey

USA . 15,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.360

10k+ parts

-

15,364

-

-

$0.360

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Verical

USA . 15,364 parts In-Stock

1+ parts

-

100+ parts

-

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$0.269

15,364

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-

-

$0.269

Distributors (In-Stock)

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Digiode

USA . 332 parts In-Stock

1+ parts

$0.226

100+ parts

-

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332

$0.226

-

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Vyrian

USA . 785 parts In-Stock

1+ parts

$0.238

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785

$0.238

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,258 parts In-Stock

1+ parts

$0.202

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-

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15,258

$0.202

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Corphita

USA . 516 parts In-Stock

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$0.214

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516

$0.214

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$0.238

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147

$0.238

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Continental Prestige Electronics

USA . 16,467 parts In-Stock

1+ parts

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100+ parts

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$0.230

10k+ parts

-

16,467

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-

$0.230

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QUARKTWIN TECHNOLOGY LTD

USA . 12,439 parts In-Stock

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12,439

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SupplyDigital Components

Austria . 6,222 parts In-Stock

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6,222

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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5,880

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Problanco Electronics

Mexico . 5,499 parts In-Stock

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5,499

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UHIMA Technologies

Türkiye . 541 parts In-Stock

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541

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Kulean Microsystems

USA . 53 parts In-Stock

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53

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TANS Electronics

Latvia . 8 parts In-Stock

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8

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Overview

Elevate your electronic designs with the J110RLRA by Onsemi, a high-quality N-CHANNEL Small Signal Field Effect Transistor (FET) that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this transistor is perfect for switching applications. With its round package shape and through-hole terminals, this transistor is easy to use and versatile. Experience the benefits of enhanced power dissipation, efficient operation in depletion mode, and a low drain-source resistance of 18 ohms. Trust Onsemi to deliver top-notch quality and performance for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and reliability for the product, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-resistance and higher switching speeds compared to P-Channel FETs, making this product efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in such scenarios.

Maximum Power Dissipation (Abs): 0.31 W

With a decent power dissipation capacity, this FET can handle moderate power levels reliably.

Maximum Drain-Source On Resistance: 18 ohm

Low ON-resistance helps in minimizing power losses and improving efficiency in switching operations.

Technical Specifications

Small Signal Field Effect Transistors (FET) J110RLRA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain-Source On Resistance:

18 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

15 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

135 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

J110RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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