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HUFA75639S3S

Onsemi

HUFA75639S3S by Onsemi

HUFA75639S3S by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max Drain Current of 56A and 0.025 ohm Drain-Source Resistance, it operates in ENHANCEMENT MODE with 110ns Turn On Time. Suitable for high-power switching circuits in automotive and industrial electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,521 parts In-Stock

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Digiode

USA . 581 parts In-Stock

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Andel Nordic

Denmark . 1,200 parts In-Stock

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$11.337

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$10.883

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Component Stockers USA

USA . 347 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 10,064 parts In-Stock

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Kulean Microsystems

USA . 7,334 parts In-Stock

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SupplyDigital Components

Austria . 6,577 parts In-Stock

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Problanco Electronics

Mexico . 4,158 parts In-Stock

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TANS Electronics

Latvia . 4,110 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,209 parts In-Stock

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Supply Digital

USA . 2,723 parts In-Stock

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Corphita

USA . 2,092 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Unleash the power of innovation with the HUFA75639S3S by Onsemi! As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their Power Field Effect Transistors. Ideal for switching applications, this N-CHANNEL FET with a built-in diode offers maximum performance with a minimum DS breakdown voltage of 100 V and a maximum drain current of 56 A. With a small outline package style and operating temperature range from -55 to 175 °C, this transistor is a game-changer in enhancing efficiency and productivity. Elevate your projects with the HUFA75639S3S today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for protection and ease of handling.

Polarity or Channel Type: N-CHANNEL

Efficient for applications that require N-Channel transistors.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance.

Surface Mount: YES

Can be easily mounted onto a circuit board, saving space and improving assembly efficiency.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage breakdown, suitable for various power applications.

Maximum Drain Current (Abs) (ID): 56 A

High current capacity allows for powerful operation.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability ensures reliable performance under demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers greater control and efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology known for its high switching speed and efficiency.

Maximum Turn On Time (ton): 110 ns

Fast turn-on time enhances responsiveness in switching applications.

Maximum Turn Off Time (toff): 70 ns

Quick turn-off time reduces power loss and improves efficiency.

Technical Specifications

Power Field Effect Transistors (FET) HUFA75639S3S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

56 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

70 ns

Maximum Turn On Time (ton):

110 ns

Trade Compliance

HUFA75639S3S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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