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HUFA76409D3

Onsemi

HUFA76409D3 by Onsemi

HUFA76409D3 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 18A Drain Current. Ideal for applications requiring high power dissipation up to 49W, such as automotive electronics due to AEC-Q101 standard compliance. Operating in enhancement mode, it offers fast turn on/off times of 59ns/136ns for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,134 parts In-Stock

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Electronic Expediters

USA . 381 parts In-Stock

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Digiode

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Component Stockers USA

USA . 646 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,018 parts In-Stock

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SupplyDigital Components

Austria . 8,315 parts In-Stock

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TANS Electronics

Latvia . 4,119 parts In-Stock

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Kulean Microsystems

USA . 3,946 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Corphita

USA . 1,768 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 764 parts In-Stock

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Corohmni

South Africa . 288 parts In-Stock

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UHIMA Technologies

Türkiye . 168 parts In-Stock

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Overview

Unlock the power of innovation with the HUFA76409D3 by Onsemi. As a leader in the industry, Onsemi guarantees top-notch quality and reliability in their Power Field Effect Transistors. With a focus on excellence, this N-CHANNEL transistor offers customers a seamless experience in various applications. From its built-in diode to its high operating temperature, this product provides unmatched value, benefits, and advantages that will elevate your projects to new heights. Choose Onsemi for cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good insulation, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and lower ON resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage of 60V ensures the transistor can handle higher voltages without breakdown, making it suitable for various power applications.

Maximum Drain Current (Abs) (ID): 18 A

With a high maximum drain current, this FET can handle high current loads, making it ideal for power applications.

Maximum Power Dissipation (Abs): 49 W

The high power dissipation capability ensures the transistor can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low ON-resistance, making the transistor efficient and suitable for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in various environmental conditions without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) HUFA76409D3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.063 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

136 ns

Maximum Turn On Time (ton):

59 ns

Trade Compliance

HUFA76409D3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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