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HUFA76429D3

Onsemi

HUFA76429D3 by Onsemi

HUFA76429D3 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 20A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.029 ohm On Resistance, and operates in ENHANCEMENT MODE. The transistor has a max power dissipation of 110W and can withstand temperatures up to 175°C.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 239 parts In-Stock

1+ parts

$1.300

100+ parts

$1.220

1k+ parts

$1.100

10k+ parts

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239

$1.300

$1.220

$1.100

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Flip Electronics (Authorized)

USA . 1,306 parts In-Stock

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1,306

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$1.101

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200

$1.101

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Digiode

USA . 2,367 parts In-Stock

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$1.235

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2,367

$1.235

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Chip Stock

USA . 3,225 parts In-Stock

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3,225

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Flip Electronics

USA . 1,306 parts In-Stock

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1,306

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Vyrian

USA . 390 parts In-Stock

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390

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Distributors (Availability)

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$1.079

100+ parts

-

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83

$1.079

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Ampacity Inc.

Singapore . 297 parts In-Stock

1+ parts

$1.100

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297

$1.100

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Semicontronic

India . 295 parts In-Stock

1+ parts

$1.100

100+ parts

$1.072

1k+ parts

$1.067

10k+ parts

-

295

$1.100

$1.072

$1.067

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$1.101

100+ parts

$1.046

1k+ parts

$0.994

10k+ parts

$0.980

100

$1.101

$1.046

$0.994

$0.980

Argo Parts USA

USA . 644 parts In-Stock

1+ parts

$1.101

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-

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644

$1.101

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Continental Prestige Electronics

USA . 636 parts In-Stock

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$1.101

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$1.079

636

$1.101

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$1.079

Corphita

USA . 2,630 parts In-Stock

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$1.170

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2,630

$1.170

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Microchip USA

USA . 6,611 parts In-Stock

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$13.455

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6,611

$13.455

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Lixinc

USA . 9,094 parts In-Stock

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9,094

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SupplyDigital Components

Austria . 8,374 parts In-Stock

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8,374

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TANS Electronics

Latvia . 6,280 parts In-Stock

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6,280

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A-Z Elektronik GmbH

Germany . 4,634 parts In-Stock

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4,634

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Supply Digital

USA . 3,965 parts In-Stock

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3,965

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Kulean Microsystems

USA . 3,490 parts In-Stock

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3,490

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Alle Elektronik GmbH

Germany . 3,089 parts In-Stock

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3,089

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Problanco Electronics

Mexico . 2,813 parts In-Stock

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2,813

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Kepictronics

USA . 1,800 parts In-Stock

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1,800

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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1,740

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Perfect Parts

USA . 1,320 parts In-Stock

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1,320

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UHIMA Technologies

Türkiye . 965 parts In-Stock

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965

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of innovation with the HUFA76429D3 by Onsemi. Crafted with precision and excellence, this Power Field Effect Transistor offers unparalleled performance and reliability for various switching applications. With a maximum drain current of 20A and a minimum DS breakdown voltage of 60V, this N-CHANNEL transistor guarantees optimal efficiency and power delivery. Elevate your projects with the cutting-edge technology of the HUFA76429D3 and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with integrated diode for better efficiency.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance.

Minimum DS Breakdown Voltage: 60 V

Ideal for handling higher voltages without breakdown.

Maximum Drain Current (ID): 20 A

High current capacity for demanding applications.

Maximum Power Dissipation (Abs): 110 W

Can handle high power dissipation, suitable for heavy-duty tasks.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, suitable for various environments.

Maximum Drain-Source On Resistance: 0.029 ohm

Low resistance for efficient current flow and minimal power loss.

Technical Specifications

Power Field Effect Transistors (FET) HUFA76429D3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

HUFA76429D3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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