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HUFA76407DK8T-F085

Onsemi

HUFA76407DK8T-F085 by Onsemi

HUFA76407DK8T-F085 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 2 ELEMENTS WITH BUILT-IN DIODE in a RECTANGULAR package style, it has a Max Drain Current of 3.8A and operates in an ENHANCEMENT MODE at temperatures ranging from -55 to 150 °C.

Median Price

$5.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 100 parts In-Stock

1+ parts

$5.190

100+ parts

$2.170

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-

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100

$5.190

$2.170

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,037 parts In-Stock

1+ parts

$0.902

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1,037

$0.902

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Digiode

USA . 2,427 parts In-Stock

1+ parts

$1.824

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2,427

$1.824

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IBS Electronics

USA . 60,000 parts In-Stock

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$1.403

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$1.403

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LIBRA Elektronik GmbH

Germany . 2,194 parts In-Stock

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2,194

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Vyrian

USA . 1,871 parts In-Stock

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1,871

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Distributors (Availability)

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Corohmni

South Africa . 473 parts In-Stock

1+ parts

$0.884

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473

$0.884

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Argo Parts USA

USA . 6,661 parts In-Stock

1+ parts

$0.902

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6,661

$0.902

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Continental Prestige Electronics

USA . 3,758 parts In-Stock

1+ parts

$0.902

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$0.884

3,758

$0.902

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$0.884

Netroflash

USA . 150 parts In-Stock

1+ parts

$0.902

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150

$0.902

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Aztec Data Supply Inc.

USA . 2,488 parts In-Stock

1+ parts

$1.130

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2,488

$1.130

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Ampacity Inc.

Singapore . 3,823 parts In-Stock

1+ parts

$1.630

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3,823

$1.630

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Semicontronic

India . 1,691 parts In-Stock

1+ parts

$1.630

100+ parts

$1.589

1k+ parts

$1.581

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1,691

$1.630

$1.589

$1.581

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Corphita

USA . 1,563 parts In-Stock

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$1.728

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1,563

$1.728

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Microchip USA

USA . 5,754 parts In-Stock

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$5.255

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$5.255

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Kulean Microsystems

USA . 6,878 parts In-Stock

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6,878

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TANS Electronics

Latvia . 6,451 parts In-Stock

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Problanco Electronics

Mexico . 2,796 parts In-Stock

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Supply Digital

USA . 1,974 parts In-Stock

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SupplyDigital Components

Austria . 1,184 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 225 parts In-Stock

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Enhance the power and efficiency of your devices with the HUFA76407DK8T-F085 from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-CHANNEL transistor features dual elements with a built-in diode for seamless operation. With a high drain current capacity of 3.8 A and low on-resistance of 0.09 ohm, this transistor offers exceptional performance. Upgrade your electronic projects with the HUFA76407DK8T-F085 and experience the unmatched value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring longevity and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs tend to have better performance in switching applications compared to P-Channel FETs, making this product suitable for efficient switching operations.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode improves performance and protects the circuit from reverse current flow, enhancing overall efficiency and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in controlling electrical signals.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage, allowing the FET to withstand higher voltages and protect the circuit from damage.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, making it easy to integrate into various electronic devices and systems.

Terminal Form: GULL WING

Gull-wing terminals offer secure connections and easy soldering onto PCBs, ensuring stable and reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have higher input impedance and lower leakage current, providing improved efficiency and performance in switching applications.

No. of Elements: 2

Having two elements allows for more complex circuit configurations and greater flexibility in circuit design.

Maximum Drain Current (Abs) (ID): 3.8 A

High maximum drain current rating allows for handling larger currents, making it suitable for high-power applications.

No. of Terminals: 8

Having 8 terminals provides more connection options and allows for more complex circuit designs.

Maximum Power Dissipation (Abs): 2.5 W

High power dissipation capability allows the FET to handle higher power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides improved performance, reliability, and efficiency in various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range allows for reliable operation in harsh environmental conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable and consistent performance.

Maximum Turn On Time (ton): 24 ns

Fast turn-on time ensures quick response and efficient switching operations.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for operation in extreme cold environments without impacting performance.

Maximum Turn Off Time (toff): 116 ns

Fast turn-off time ensures quick switching transitions and reduces power losses during operation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Maximum Drain Current (ID): 3.5 A

High maximum drain current rating allows for handling larger currents, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.09 ohm

Low on-resistance results in minimal power loss and efficient switching performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and allows for multiple connection options.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for extended durations, ensuring reliable soldering and durability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and reliability under various assembly processes.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high-quality and reliable performance in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) HUFA76407DK8T-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

3.8 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

116 ns

Maximum Turn On Time (ton):

24 ns

Trade Compliance

HUFA76407DK8T-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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