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FQU5N60C

Onsemi

FQU5N60C by Onsemi

FQU5N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 11.2A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 2.5 ohm RDS(on), and operates in ENHANCEMENT MODE up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 3,124 parts In-Stock

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Digiode

USA . 2,126 parts In-Stock

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Vyrian

USA . 1,431 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Corohmni

South Africa . 53 parts In-Stock

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$0.850

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53

$0.850

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Aztec Data Supply Inc.

USA . 40 parts In-Stock

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$1.136

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40

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Andel Nordic

Denmark . 137 parts In-Stock

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$10.110

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$9.706

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$9.706

137

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$9.706

AZTECH Wire

Italy . 545 parts In-Stock

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$17.501

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Ampacity Inc.

Singapore . 458 parts In-Stock

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$53.050

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Kepictronics

USA . 71,000 parts In-Stock

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Lixinc

USA . 19,610 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,137 parts In-Stock

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SupplyDigital Components

Austria . 6,675 parts In-Stock

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TANS Electronics

Latvia . 6,193 parts In-Stock

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Continental Prestige Electronics

USA . 5,797 parts In-Stock

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Kulean Microsystems

USA . 4,484 parts In-Stock

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Argo Parts USA

USA . 4,483 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,091 parts In-Stock

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Problanco Electronics

Mexico . 2,575 parts In-Stock

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Supply Digital

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Aranea Global

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Corphita

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UHIMA Technologies

Türkiye . 291 parts In-Stock

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Overview

Discover the power of the FQU5N60C by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor with a built-in diode. Designed for switching applications, this transistor offers enhanced performance and reliability, making it ideal for a wide range of electronic projects. With a maximum breakdown voltage of 600V and a pulsing drain current of 11.2A, this transistor delivers exceptional power and efficiency. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the FQU5N60C brings to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring longevity and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally offer better performance and efficiency compared to P-Channel FETs, making this product a suitable choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing overall circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it ideal for high-frequency operation.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows this FET to handle large voltages safely, making it suitable for high-power applications and voltage regulation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into existing circuit designs, providing versatility and convenience in installation.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer strong mechanical connections, making it easier to solder and secure the FET to the circuit board for stable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and require less input power to operate, improving overall efficiency and performance in various applications.

Maximum Pulsed Drain Current (IDM): 11.2 A

The high maximum pulsed drain current capability allows this FET to handle sudden current spikes without damage, ensuring robust performance in dynamic load conditions.

Avalanche Energy Rating (EAS): 210 mJ

With a high avalanche energy rating, this FET can withstand energy spikes and transients, providing protection against potential circuit failures in harsh operating environments.

No. of Terminals: 3

The three-terminal design simplifies circuit connections and reduces complexity, making it easier to integrate this FET into different circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for compact circuit layouts, making this FET suitable for applications where space is limited or miniaturization is required.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low noise, and excellent reliability in FETs, making this product a reliable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and maintain stable performance in hot environments, ensuring long-term reliability.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high switching speeds, low on-resistance, and good thermal conductivity, providing excellent performance and efficiency in various applications.

Maximum Drain Current (ID): 2.8 A

The maximum drain current rating of 2.8 A allows this FET to handle moderate current loads, making it suitable for a wide range of low to medium power applications.

Maximum Drain-Source On Resistance: 2.5 ohm

With a low drain-source on-resistance, this FET minimizes power losses and improves efficiency in switching applications, making it an energy-efficient choice for power management.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and ensures easy connections, reducing the chances of errors during installation and enabling quick and reliable setup.

Technical Specifications

Power Field Effect Transistors (FET) FQU5N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

210 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

11.2 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQU5N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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