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FQU5P20TU

Onsemi

FQU5P20TU by Onsemi

FQU5P20TU by Onsemi is a P-CHANNEL Power FET with 200V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max IDM of 14.8A and EAS of 330mJ. Operating in ENHANCEMENT MODE, it has a Drain Current of 3.7A and On Resistance of 1.4 ohm.

Median Price

$0.471

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 70,399 parts In-Stock

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DigiKey

USA . 11,624 parts In-Stock

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$0.400

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$0.400

Rochester

USA . 2,003 parts In-Stock

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$0.471

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$0.391

10k+ parts

$0.348

2,003

-

$0.471

$0.391

$0.348

Verical

USA . 2,003 parts In-Stock

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$0.588

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2,003

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$0.588

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Distributors (In-Stock)

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Digiode

USA . 1,911 parts In-Stock

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$0.367

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Vyrian

USA . 2,387 parts In-Stock

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$0.386

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Flip Electronics

USA . 70,399 parts In-Stock

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70,399

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Odi Ramu Company

Canada . 2,203 parts In-Stock

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Corphita

USA . 874 parts In-Stock

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$0.347

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874

$0.347

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Corohmni

South Africa . 413 parts In-Stock

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$0.386

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413

$0.386

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Native Components

USA . 863 parts In-Stock

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$0.561

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$0.561

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Northwest PG Solutions

USA . 2,018 parts In-Stock

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$0.617

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Microchip USA

USA . 2,054 parts In-Stock

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$5.655

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Perfect Parts

USA . 56,448 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Kulean Microsystems

USA . 5,158 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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SupplyDigital Components

Austria . 3,444 parts In-Stock

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Problanco Electronics

Mexico . 3,208 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 961 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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Allen Electronics Distributors

USA . 50 parts In-Stock

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Component Stockers USA

USA . 42 parts In-Stock

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Overview

Experience unparalleled power and performance with the FQU5P20TU by Onsemi, a top-of-the-line Power FET designed to elevate your applications to new heights. With its high-quality construction and reliable single configuration featuring a built-in diode, this P-channel transistor is perfect for switching tasks. Whether you're looking to enhance the efficiency of your projects or boost overall performance, this transistor offers a value-packed solution that delivers exceptional benefits and advantages. Trust in Onsemi's expertise and unlock the full potential of your designs with the FQU5P20TU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower ON-state resistance and better efficiency compared to N-channel FETs, making them a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse voltage spikes, enhancing its overall performance and functionality.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low power consumption, making it suitable for a wide range of electronic devices.

Minimum DS Breakdown Voltage: 200 V

The high breakdown voltage allows the FET to handle high voltages, making it suitable for applications where voltage spikes or surges may occur.

Maximum Power Dissipation (Abs): 45 W

With a high power dissipation rating, this FET can handle higher levels of power without overheating, ensuring stable performance under demanding conditions.

Maximum Drain-Source On Resistance: 1.4 ohm

The low ON-resistance of the FET results in minimal power loss and higher efficiency during operation, making it an ideal choice for power management applications.

Technical Specifications

Power Field Effect Transistors (FET) FQU5P20TU attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

330 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

3.7 A

Maximum Drain Current (ID):

3.7 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14.8 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQU5P20TU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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