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FQP4N20L

Onsemi

FQP4N20L by Onsemi

FQP4N20L by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage and 15.2A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 52mJ EAS rating, and operates in ENHANCEMENT MODE up to 150 °C.

Median Price

$0.667

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 134 parts In-Stock

1+ parts

$0.297

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$0.260

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Chip1Stop

Japan . 134 parts In-Stock

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$0.757

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DigiKey

USA . 12 parts In-Stock

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$1.740

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Rochester

USA . 48,282 parts In-Stock

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$0.643

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$0.533

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$0.475

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Verical

USA . 28,874 parts In-Stock

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$0.667

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$0.594

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USA . 50 parts In-Stock

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Vyrian

USA . 171 parts In-Stock

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$0.422

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Digiode

USA . 1,502 parts In-Stock

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$0.501

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DigiKey Marketplace

USA . 2,000 parts In-Stock

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Bristol Electronics

USA . 420 parts In-Stock

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Atlantic Semiconductor

USA . 420 parts In-Stock

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Sunrise Surplus Inc.

USA . 30 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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$0.422

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456

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Corphita

USA . 1,858 parts In-Stock

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$0.474

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Native Components

USA . 87 parts In-Stock

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$1.180

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Northwest PG Solutions

USA . 819 parts In-Stock

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$1.298

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$1.298

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Andel Nordic

Denmark . 500 parts In-Stock

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$3.901

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$3.745

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$3.745

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$3.901

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$3.745

Microchip USA

USA . 391 parts In-Stock

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$7.735

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RC Electronics

USA . 86,189 parts In-Stock

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$0.550

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 7,830 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Problanco Electronics

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Perfect Parts

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Supply Digital

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TANS Electronics

Latvia . 1,681 parts In-Stock

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SupplyDigital Components

Austria . 1,573 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,204 parts In-Stock

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

Türkiye . 915 parts In-Stock

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Overview

Enhance your power circuit designs with the FQP4N20L by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor (FET) with a built-in diode. With a maximum operating temperature of 150 °C and low on-resistance, this transistor is perfect for switching applications, offering enhanced performance and efficiency. Trust in Onsemi's reputation for excellence in semiconductor technology to deliver reliable solutions for your electronic projects. Upgrade your systems with the FQP4N20L and experience the benefits of superior performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient flow of current, making the product suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in such scenarios.

Minimum DS Breakdown Voltage: 200 V

Ability to withstand high voltage levels makes the product suitable for high-power applications.

Maximum Power Dissipation (Abs): 45 W

High power dissipation rating allows the transistor to handle heavy loads without overheating.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures the transistor can function reliably in various environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FQP4N20L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

52 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

3.6 A

Maximum Drain Current (ID):

3.8 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

15.2 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP4N20L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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